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TSOP54
(10 pièces au total)| Numéro de pièce fabricant | Description | Fabricant | En stock | Opération |
|---|---|---|---|---|
| W9812G6GH-75 | Advanced SDRAM solution offering enhanced performance and reliabilit | WINBOND | 361 | Add to BOM |
| MT48LC16M16A2P-7E:G | Enhanced performance and capacity for data-intensive systems and network | MICRON | 7 161 | Add to BOM |
| MT48LC4M16A2P-75:G | The chip operates at a voltage of 3.3V and comes in a 54-pin TSOP-II package | MICRON | 5 | Add to BOM |
| M12L64164A-7TG | Advanced CMOS technology enables rapid data access and processing | ESMT | 7 | Add to BOM |
| W9825G6JH-6 | DRAM Chip SDRAM 256Mbit 4Mx16x4 3.3V 54-Pin TSOP-II | Winbond Electronics Corp | 1 850 | Add to BOM |
| CY14B108N-ZSP45XI | Memory chip with 8 megabits capacity, operating at 3 volts, in a 54-pin TSOP-II package | Infineon Technologies Corporation | 2 278 | Add to BOM |
| AS4C32M16SB-7TIN | DRAM 512M 3.3V 143MHz 32M x 16 SDRAM | alliance memory | 7 955 | Add to BOM |
| MT48LC16M16A2P-6A IT:G | SDRAM256M16MX16TSOP, TRAY, DRAM; SDRAM256M16MX16TSOP, TRAY, DRAM | micron technology | 8 103 | Add to BOM |
| MT48LC4M16A2P-6A AIT:J | Reliable memory module for demanding automotive system | MICRON | 9 745 | Add to BOM |
| K4S641632F-TC70 | The K4S64E3210M-F-TC70 is a reliable and cost-effective solution for applications requiring large amounts of on-board memory | Samsung | 2 237 | Add to BOM |
Autre forfait