Altera 5CEFA7F27I7N

Points de pièce

• The 5CEFA7F27I7N is a field programmable gate array (FPGA) chip manufactured by Altera (now Intel). It features 27,520 logic elements, 612 embedded memory blocks, and 427 user I/O pins. This FPGA chip is commonly used in a variety of applications such as telecommunications, industrial automation, and automotive electronics.

• Equivalent

  Some equivalent products of the 5CEFA7F27I7N chip include other Altera/Intel Cyclone V series FPGA chips such as the 5CEFA5F23C7N, 5CEFA7F23I7N, and 5CEFA7K40I8N. These chips offer similar performance and functionality for a variety of applications.

• Features

  Some features of the 5CEFA7F27I7N include a high-performance FPGA with embedded memory blocks, digital signal processing capabilities, and support for a wide range of applications. It also offers low power consumption and high-speed connectivity options, making it well-suited for various industrial and embedded applications.

• Pinout

  The 5CEFA7F27I7N is a Altera Cyclone V FPGA with 776 pin counts. It offers a range of functions such as embedded memory, digital signal processing, and hardened floating-point arithmetic. This FPGA is capable of handling high-performance applications in industries such as telecommunications, automotive, and industrial automation.

• Manufacturer

  Intel Corporation is the manufacturer of 5CEFA7F27I7N. It is a multinational technology company that specializes in the design, manufacture, and sale of computer processors and related hardware. Intel is one of the largest and most well-known technology companies in the world, providing products for a wide range of industries including personal computing, data centers, and cloud computing.

• Application Field

  1. Industrial automation: 5CEFA7F27I7N is used for controlling and monitoring various industrial processes. 2. Robotics: It is utilized in controlling the movement and actions of robots in various applications. 3. Automotive: Used for engine control, vehicle diagnostics, and communication systems in automobiles. 4. Aerospace: Employed in flight control systems and communications in aircraft. 5. Telecommunications: Utilized in networking equipment for data processing and control.

• Package

  The 5CEFA7F27I7N chip is in a BGA package, with a form factor of 1152-ball, 844-pin. The size of the chip is 27mm x 27mm, making it suitable for applications that require a compact and high-performance FPGA solution.