Altera EP4SGX230FF35C3N

Points de pièce

• The EP4SGX230FF35C3N chip is a member of the Stratix IV FPGA family from Intel. It is a high-performance field-programmable gate array (FPGA) chip designed for applications in various industries such as telecommunications, defense, and aerospace. It offers a large number of logic elements, high-speed transceivers, and advanced features to enable the development of complex and data-intensive systems.

• Equivalent

  There are no direct equivalent products to the EP4SGX230FF35C3N chip. However, other similar devices in the Intel Stratix IV GX FPGA family can be considered as alternatives, such as the EP4SGX230FF35C2N or the EP4SGX230KF40C2N, depending on specific requirements.

• Features

  EP4SGX230FF35C3N is a high-performance field-programmable gate array (FPGA) from Intel's Stratix IV GX series. It offers 230,000 logic elements, numerous high-speed transceivers, various memory options, and advanced embedded features. This FPGA provides a flexible and scalable solution for advanced digital designs requiring high processing power and efficient connectivity.

• Pinout

  The EP4SGX230FF35C3N is a field-programmable gate array (FPGA) with 230,208 logic elements, a 35% utilization rate, and a 35% resources utilization variant. It has 1,056 pins and supports various functions such as data storage, processing, and control in electronic devices.

• Manufacturer

  The manufacturer of the EP4SGX230FF35C3N is Altera Corporation. Altera is a semiconductor company that primarily focuses on designing and manufacturing programmable logic devices and related development software.

• Application Field

  The EP4SGX230FF35C3N is a field-programmable gate array (FPGA) that can be used in a variety of application areas including high-performance computing, data centers, network processing, digital signal processing, and aerospace and defense systems. It offers high-speed processing capabilities and customizable functionality, making it suitable for demanding applications in these fields.

• Package

  The EP4SGX230FF35C3N chip is packaged in a flip-chip ball grid array (FCBGA) package. Its form factor is a quad flat no-lead (QFN) package, and its size is 35 mm x 35 mm.