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$5000Infineon ISP772T
Offering current limiting capabilities
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Marques: Infineon Technologies Corporation
Pièce Fabricant #: ISP772T
Fiche de données: ISP772T Fiche de données (PDF)
Colis/Caisse: DSO-8
type de produit: Power Distribution Switches, Load Drivers
Statut RoHS:
État des stocks: 3 764 pièces, nouveau original
Warranty: 1 Year Ovaga Warranty - Find Out More
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ISP772T Description générale
The ISP772T from Infineon Technologies is a versatile power management IC designed for voltage monitoring and supervision in the automotive and industrial sectors. With its overvoltage and undervoltage detection features, this integrated circuit ensures the protection of sensitive components within various systems. Its rugged design meets the stringent requirements of automotive and industrial standards, making it ideal for operation in harsh environments. The ISP772T operates reliably across a wide temperature range, providing consistent performance in diverse operating conditions. Its compact packaging allows for easy integration into circuit designs, saving valuable board space. The IC offers flexibility with its voltage detection thresholds, hysteresis levels, and output configurations, catering to a range of application requirements. It may also include diagnostic features, such as status indication outputs, to enhance system monitoring capabilities
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Caractéristiques
Paramètre | Valeur | Paramètre | Valeur |
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Source Content uid | ISP772T | Pbfree Code | Yes |
Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | Part Package Code | SOIC |
Package Description | SOP, SOP8,.25 | Pin Count | 8 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.39.00.01 | Samacsys Manufacturer | Infineon |
Built-in Protections | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | Driver Number of Bits | 1 |
Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | JESD-30 Code | R-PDSO-G8 |
Moisture Sensitivity Level | 3 | Number of Functions | 1 |
Number of Terminals | 8 | Output Current Flow Direction | SINK |
Package Body Material | PLASTIC/EPOXY | Package Code | SOP |
Package Equivalence Code | SOP8,.25 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE | Peak Reflow Temperature (Cel) | 260 |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | COMMERCIAL EXTENDED | Terminal Finish | TIN |
Terminal Form | GULL WING | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 |
Expédition
Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
Modalités de paiement | Frais de main | |
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Virement bancaire | facturer des frais bancaires de 30,00 $ US. |
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Pay Pal | facturer des frais de service de 4,0 %. |
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Carte de crédit | facturez des frais de service de 3,5%. |
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Western union | charge US.00 banking fee. |
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Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Étape1 :Produit
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Étape2 :Emballage sous vide
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Étape3 :Sac antistatique
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Étape4 :Emballage individuel
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Étape5 :Boîtes d'emballage
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Étape6 :étiquette d'expédition à code-barres
Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Points de pièce
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ISP772T chip is a low-power, high-performance, quad-output system-in-package (SiP) solution for camera modules in smartphones and other portable devices. It integrates image signal processing, power management, and thermal management functions to optimize performance and power consumption.
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Equivalent
Some equivalent products of the ISP772T chip include the ON Semiconductor NCP12600, Infineon TEA1733, and STMicroelectronics L6562A. These chips are also used in power supply applications and offer similar features and functionality to the ISP772T. -
Features
The ISP772T is a high-side power switch with integrated protection features such as overcurrent and short-circuit protection. It has a wide input voltage range of 2.7V to 38V, a low quiescent current of 10µA, and a high output current capability of up to 5A. -
Pinout
The ISP772T is a quad high-side power switch with a pin count of 20. The functions of the device include current limiting, thermal shut down, and reverse polarity protection. It is commonly used in automotive applications to control lamps and other loads. -
Manufacturer
The ISP772T is manufactured by Intersil Corporation, a semiconductor company that specializes in designing and producing high-performance analog and mixed-signal integrated circuits. Intersil Corporation was founded in 1999 and is headquartered in Milpitas, California. -
Application Field
The ISP772T is commonly used in automotive applications for controlling various lighting functions such as headlamps, tail lamps, and interior lighting. It is also used in industrial and consumer applications for controlling LED lighting, as well as in smart home devices for controlling lighting and other electronic functions. -
Package
The ISP772T chip comes in a surface-mount package type known as SOIC-16. It has a form factor of a small outline integrated circuit (SOIC) and measures 10.3mm x 5.3mm x 1.75mm in size.
Nous fournissons des produits de haute qualité, un service attentionné et une garantie après-vente
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Nous avons des produits riches, pouvons répondre à vos différents besoins.
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La quantité minimum de commande commence à partir de 1 pièce.
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Les frais d'expédition internationaux les plus bas commencent à partir de 0,00 $
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Garantie de qualité de 365 jours pour tous les produits