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$5000NXP LPC2210FBD144
16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface
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Marques: NXP Semiconductor
Pièce Fabricant #: LPC2210FBD144
Fiche de données: LPC2210FBD144 Datasheet (PDF)
Colis/Caisse: TQFP144
type de produit: Microcontrollers
Statut RoHS:
État des stocks: 3 157 pièces, nouveau original
Warranty: 1 Year Ovaga Warranty - Find Out More
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LPC2210FBD144 Description générale
LPC2210FBD144 is a microcontroller chip from NXP Semiconductors, which is now part of Qualcomm. It is a member of the LPC2000 family of ARM-based microcontrollers, which are designed for embedded applications requiring high performance and low power consumption.
![lpc2210fbd144 lpc2210fbd144](/files/uploads/product/b/lpc2210fbd14420160927102825_2662.jpg)
Caractéristiques
- ARM7TDMI-S processor core running at up to 60 MHz
- 128 KB of flash memory and 32 KB of SRAM
- Ethernet MAC, USB 2.0 full-speed interface, and CAN 2.0B
- Multiple serial interfaces, including two UARTs, two SPI, and two I2C
- Multiple timers, including four 32-bit timers with capture/compare channels
- 10-bit ADC with eight channels
- On-chip oscillator with PLL and on-chip voltage regulator
Application
- AT91SAM7X256 from Microchip
- STM32F103 from STMicroelectronics
- MSP432P401R from Texas Instruments
- SAM3X8E from Atmel
Caractéristiques
Paramètre | Valeur | Paramètre | Valeur |
---|---|---|---|
Source Content uid | LPC2210FBD144 | Pbfree Code | Yes |
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | NXP SEMICONDUCTORS | Part Package Code | QFP |
Package Description | LFQFP, QFP144,.87SQ,20 | Pin Count | 144 |
Reach Compliance Code | ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | Has ADC | YES |
Additional Feature | ALSO REQUIRES 3.3 V SUPPLY | Address Bus Width | 24 |
Bit Size | 32 | CPU Family | ARM7 |
Clock Frequency-Max | 50 MHz | DAC Channels | NO |
DMA Channels | NO | External Data Bus Width | 32 |
JESD-30 Code | S-PQFP-G144 | JESD-609 Code | e3 |
Length | 20 mm | Moisture Sensitivity Level | 2 |
Number of I/O Lines | 76 | Number of Terminals | 144 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
PWM Channels | YES | Package Body Material | PLASTIC/EPOXY |
Package Code | LFQFP | Package Equivalence Code | QFP144,.87SQ,20 |
Package Shape | SQUARE | Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
Qualification Status | Not Qualified | RAM (bytes) | 16384 |
Seated Height-Max | 1.6 mm | Speed | 60 MHz |
Supply Voltage-Max | 1.95 V | Supply Voltage-Min | 1.65 V |
Supply Voltage-Nom | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | MATTE TIN | Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm | Terminal Position | QUAD |
Width | 20 mm |
Expédition
Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
Modalités de paiement | Frais de main | |
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Virement bancaire | facturer des frais bancaires de 30,00 $ US. |
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Pay Pal | facturer des frais de service de 4,0 %. |
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Carte de crédit | facturez des frais de service de 3,5%. |
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Western union | charge US.00 banking fee. |
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Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Étape1 :Produit
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Étape2 :Emballage sous vide
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Étape3 :Sac antistatique
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Étape4 :Emballage individuel
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Étape5 :Boîtes d'emballage
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Étape6 :étiquette d'expédition à code-barres
Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Points de pièce
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The LPC2210FBD144 is a 16/32-bit ARM microcontroller with a 32KB on-chip SRAM and 128KB on-chip Flash memory. It also features multiple serial interfaces, general-purpose I/O pins, and timers for various applications. The chip is widely used in embedded systems, robotics, and industrial control applications due to its high performance and low power consumption.
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Equivalent
The equivalent products of LPC2210FBD144 chip are LPC2212FBD144, LPC2214FBD64, and LPC2214FBD100. These chips are part of the LPC2200 series from NXP Semiconductors and offer similar features and capabilities to the LPC2210FBD144. -
Features
The LPC2210FBD144 is a microcontroller from NXP Semiconductors with features such as a 16/32-bit ARM7TDMI-S CPU, 128 KB flash memory, 64 KB RAM, 2 UARTs, 2 SPI, 2 I2C, 8-channel 10-bit ADC, and 6 PWM channels. It also has on-chip debugging and programming functions. -
Pinout
The LPC2210FBD144 is a microcontroller from NXP with a 144-pin package. It features an ARM7TDMI-S core, 128 KB of flash memory, and 64 KB of SRAM. The pin functions include GPIO, UART, SPI, I2C, ADC, and JTAG debug interface. -
Manufacturer
The LPC2210FBD144 is manufactured by NXP Semiconductors, a Dutch semiconductor manufacturer. NXP Semiconductors specializes in the production of a wide range of semiconductor products for various industries, including automotive, consumer electronics, and industrial applications. -
Application Field
The LPC2210FBD144 is commonly used in industrial automation, robotics, motor control, and networking applications. It offers high performance, flexibility, and reliability for various embedded system designs that require real-time processing, communication interfaces, and control capabilities. -
Package
The LPC2210FBD144 chip comes in a Ball Grid Array (BGA) package, with a form factor of 144-ball and a size of 13mm x 13mm.
Fiche de données PDF
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La quantité minimum de commande commence à partir de 1 pièce.
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Garantie de qualité de 365 jours pour tous les produits
I've ordered multiple times and haven't had a single issue. Top-notch components from a top-notch supplier.