PI7C9X130DNDE

Points de pièce

• The PI7C9X130DNDE is a PCI-to-PCI bridge chip that provides a high-performance interconnect solution for connecting multiple PCI devices with low latency and low power consumption. It supports a wide range of PCI specifications and features advanced power management capabilities. This chip is commonly used in applications requiring multiple PCI devices to communicate efficiently with each other.

• Equivalent

  Equivalent products of PI7C9X130DNDE chip are PLX Technology's PEX8613, Texas Instruments' TS3PCIU2X, and ASMedia's ASM1184e. These chips all provide PCIe-to-PCI bridge functionality for connecting PCI devices to PCIe buses.

• Features

  - Dual PCI Express Gen3/Gen4 retimer - Supports 1x2, 2x1, 1x4, and 2x2 configurations - Supports a wide range of data rates and link widths - Features internal and external EEPROM for configuration - Low power consumption and small form factor for easy integration

• Pinout

  The PI7C9X130DNDE is a 56-pin PCIe 3.0 packet switch with integrated clock buffer and data buffer. It is used for high-performance and low-latency applications in networking, storage, and other communication systems. The device supports up to 24 lanes of PCIe 3.0 and provides advanced features for system optimization and configuration.

• Manufacturer

  The manufacturer of PI7C9X130DNDE is Diodes Incorporated. Diodes Incorporated is a manufacturer and supplier of discrete, analog, and mixed-signal semiconductor products for a wide range of applications, including automotive, consumer electronics, computing, and communications.

• Application Field

  The PI7C9X130DNDE is commonly used in industrial automation, networking, communication equipment, servers, and data storage applications. It is also utilized in PCIe bridges and switches, providing high-speed connectivity and support for multiple protocols such as SATA, SAS, USB, and Ethernet.

• Package

  The PI7C9X130DNDE chip comes in a QFN package type, with a size of 56-Pin. The form factor is Surface Mount (SMD), which makes it suitable for compact electronic designs.