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Commandes de plus de

$5000
bénéficient $50 d'une remise !

Microchip PM8056B-FEI

Interface - I/O Expanders SXP 68x12G

ISO14001 ISO9001 DUNS

Marques: Microchip Technology, Inc

Pièce Fabricant #: PM8056B-FEI

Fiche de données: PM8056B-FEI Datasheet (PDF)

Colis/Caisse: BFBGA

type de produit: I/O Expanders

Statut RoHS:

État des stocks: 2 957 pièces, nouveau original

Warranty: 1 Year Ovaga Warranty - Find Out More

Citation courte

Veuillez soumettre une demande de prix pour PM8056B-FEI ou envoyez-nous un email: E-mail: [email protected], nous vous contacterons dans les 12 heures.

Caractéristiques

  • SAS-3 T10 zoning for secure storage
  • Ultra low switching latency for improved system performance
  • SAS and SATA edge-buffering preserves customers’ investment by improving performance with existing 3G and 6G drives
  • Table-to-table routing removes need for keyed connectors
  • Integrated Ethernet port for seamless interface to management entity
  • Integrated MIPS processor for enclosure management
  • Firmware compatible with Microchip SAS 3 Gbps and 6 Gbps SAS expanders and stand-alone enclosure management controllers
  • 12G SAS signaling support for up to 10m mini-SAS HD passive copper cable
  • Optical SAS support
  • Early power off warning (EPOW) support
  • SAS and SATA edge-buffering support
  • Ultra-low switching latency to improve system performance
  • Quad SPI or parallel flash support; optional inline ECC on the parallel flash
  • T10 zoning support (up to 256 zones)
  • Port mirroring for system debug
  • Local bus data integrity protection
  • Real-time eye capture with enhanced BER eye mask and estimation
  • Non-disruptive zero down time firmware update support
  • Position-independent firmware image support to simplify firmware image management/download
  • Compatible enclosure management firmware architecture with SXP 3G/6G products
  • Real-time clock (1 µS counter up to 35+ years)
  • Enhanced processing subsystem (MIPS 34Kc at 600 MHz)
  • Backward-compatibility with Microchii’s 6G/3G SXP devices
  • High-Speed I/O
  • SAS-3 (12 Gbps, 6 Gbps, 3 Gbps, 1.5 Gbps) and SATA-3 (6 Gbps, 3 Gbps, 1.5 Gbps) operation
  • Support for up to 4K SAS addresses
  • Automated decision feedback equalizer (DFE) per SAS-3
  • Programmable continuous time linear equalizer for SATA-3
  • Supports spread-spectrum clocking (SSC) per SAS/SATA-3
  • Per-PHY configurable transmit and receive SSC
  • Per-PHY programmable transmit amplitude and emphasis
  • Integrated resistive termination
  • SAS 3.0-compliant back-channel training (SAS3 speed negotiation)
  • Peripheral Interfaces
  • 4 UART interfaces for system monitoring and debugging
  • 4 SGPIO interfaces (or additional TWI per SFF-8448)
  • Up to 81 GPIO pins
  • Eight dedicated two-wire interfaces (up to twelve total) for device configuration and control of external interfaces
  • 16-bit local bus interface for connecting to NOR flash and SRAM
  • SPI, DSPI, and QSPI interface
  • 10/100 Ethernet MAC port
  • JTAG and EJTAG interface
  • Statistics and Performance Monitoring
  • Per-port error counters for comprehensive diagnostic capability
  • Programmable PMON counters and interrupt generation
  • Per-link PRBS and CJPAT pattern generators and loop-backs for linkintegrity diagnostics
  • Real-time clock
  • Firmware Development Kit
  • Zoning configuration interface
  • SAM4/SPC4/SES3-compatible SES target with Enclosure Management Application reference design
  • SAS-3-compatible protocol stack in virtual SAS/SMP port
  • SSP/STP Initiator API supports communication with SSP/STP targets over SAS links
  • SMP routing management including topology discovery
  • Firmware download over multiple in-band and out-of-band interfaces
  • Expander diagnostics API
  • Disk spin-up control and disk qualification API
  • Peripheral drivers for TWI, UART, SGPIO, and Ethernet interfaces
  • TCP/IP enables management of the SXP 12G through remote network
  • Error detection, logging, and reporting
  • Wake up system through Ethernet or SAS port
  • Chiplink Diagnostic Utility
  • Supports advanced features for validation, characterization and debugging of Microchip expanders
  • Includes full SAS tool suite and a macro interface for user-authored animation scripts
  • Third Party Support
  • Green Hills MULTI development environment and EJTAG debugger
  • SAS-3 (12 Gbps, 6 Gbps, 3 Gbps, 1.5 Gbps) and SATA-3 (6 Gbps, 3 Gbps, 1.5 Gbps) operation
  • Support for up to 4K SAS addresses
  • Automated decision feedback equalizer (DFE) per SAS-3
  • Programmable continuous time linear equalizer for SATA-3
  • Supports spread-spectrum clocking (SSC) per SAS/SATA-3
  • Per-PHY configurable transmit and receive SSC
  • Per-PHY programmable transmit amplitude and emphasis
  • Integrated resistive termination
  • SAS 3.0-compliant back-channel training (SAS3 speed negotiation)
  • 4 UART interfaces for system monitoring and debugging
  • 4 SGPIO interfaces (or additional TWI per SFF-8448)
  • Up to 81 GPIO pins
  • Eight dedicated two-wire interfaces (up to twelve total) for device configuration and control of external interfaces
  • 16-bit local bus interface for connecting to NOR flash and SRAM
  • SPI, DSPI, and QSPI interface
  • 10/100 Ethernet MAC port
  • JTAG and EJTAG interface
  • Per-port error counters for comprehensive diagnostic capability
  • Programmable PMON counters and interrupt generation
  • Per-link PRBS and CJPAT pattern generators and loop-backs for linkintegrity diagnostics
  • Real-time clock
  • Zoning configuration interface
  • SAM4/SPC4/SES3-compatible SES target with Enclosure Management Application reference design
  • SAS-3-compatible protocol stack in virtual SAS/SMP port
  • SSP/STP Initiator API supports communication with SSP/STP targets over SAS links
  • SMP routing management including topology discovery
  • Firmware download over multiple in-band and out-of-band interfaces
  • Expander diagnostics API
  • Disk spin-up control and disk qualification API
  • Peripheral drivers for TWI, UART, SGPIO, and Ethernet interfaces
  • TCP/IP enables management of the SXP 12G through remote network
  • Error detection, logging, and reporting
  • Wake up system through Ethernet or SAS port
  • Supports advanced features for validation, characterization and debugging of Microchip expanders
  • Includes full SAS tool suite and a macro interface for user-authored animation scripts
  • Green Hills MULTI development environment and EJTAG debugger
Microchip Technology, Inc Inventory

Caractéristiques

Paramètre Valeur Paramètre Valeur
feature-process-technology feature-minimum-operating-supply-voltage-v
feature-maximum-operating-supply-voltage-v feature-packaging
feature-rad-hard feature-pin-count
feature-supplier-package feature-standard-package-name1
feature-cecc-qualified feature-esd-protection
feature-escc-qualified feature-military
feature-aec-qualified feature-aec-qualified-number
feature-auto-motive feature-p-pap
feature-eccn-code EAR99 feature-svhc Yes
feature-svhc-exceeds-threshold No

Expédition

Type d'expédition Frais d'expédition Délai de mise en œuvre
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 jours
Fedex FedEx $20.00-$40.00 (0.50 KG) 2-5 jours
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 jours
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 jours
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 jours
LA POSTE AÉRIENNE ENREGISTRÉE LA POSTE AÉRIENNE ENREGISTRÉE $20.00-$40.00 (0.50 KG) 2-5 jours

Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.

Paiement

Modalités de paiement Frais de main
Virement bancaire Virement bancaire facturer des frais bancaires de 30,00 $ US.
Pay Pal Pay Pal facturer des frais de service de 4,0 %.
Carte de crédit Carte de crédit facturez des frais de service de 3,5%.
Western union Western union charge US.00 banking fee.
Paiement de Petit Montant Paiement de Petit Montant facturer des frais bancaires de 0,00 $ US.

Garanties

1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.

2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.

Emballage

  • Produit

    Étape1 :Produit

  • Emballage sous vide

    Étape2 :Emballage sous vide

  • Sac antistatique

    Étape3 :Sac antistatique

  • Emballage individuel

    Étape4 :Emballage individuel

  • Boîtes d'emballage

    Étape5 :Boîtes d'emballage

  • étiquette d'expédition à code-barres

    Étape6 :étiquette d'expédition à code-barres

Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.

L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.

Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.

Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.

  • ESD
  • ESD

Points de pièce

  • The PM8056B-FEI is a 5G system-on-a-chip (SoC) developed by Qualcomm for mobile devices. It offers advanced connectivity, power efficiency, and performance for a seamless user experience. The chip integrates multiple components such as a modem, processor, and AI engine, making it an ideal solution for high-speed data transfer and multimedia applications.
  • Equivalent

    Equivalent products of PM8056B-FEI chip include Qualcomm Snapdragon 835, MediaTek Helio P60, and Samsung Exynos 8895. These chips are similar in performance and features, making them suitable alternatives for various electronic devices.
  • Features

    The PM8056B-FEI is a high-frequency, energy-efficient integrated circuit designed for power management applications. It features a wide input voltage range, low dropout voltage, high efficiency, integrated voltage regulation, and thermal protection. Its small form factor makes it ideal for compact electronic devices.
  • Pinout

    The PM8056B-FEI is a power management integrated circuit with a 226-pin count. It includes functions such as voltage regulation, power sequencing, and battery charging for mobile devices.
  • Manufacturer

    PM8056B-FEI is manufactured by QUALCOMM Technologies, Inc. It is a leading semiconductor and telecommunications equipment company known for producing wireless communication technologies, including processors, modems, and chips for smartphones, IoT devices, and other electronic devices.
  • Application Field

    PM8056B-FEI is used in various applications such as network infrastructure, telecommunications, industrial automation, and military and aerospace systems. It provides advanced functionalities like low-power consumption, high-performance processing, and secure communication capabilities, making it ideal for a wide range of high-demanding applications.
  • Package

    The PM8056B-FEI chip is a BGA (Ball Grid Array) package with a form factor size of 11.5mm x 11.5mm.

Fiche de données PDF

Spécification préliminaire PM8056B-FEI PDF Télécharger

Nous fournissons des produits de haute qualité, un service attentionné et une garantie après-vente

  • Produit

    Nous avons des produits riches, pouvons répondre à vos différents besoins.

  • quantity

    La quantité minimum de commande commence à partir de 1 pièce.

  • shipping

    Les frais d'expédition internationaux les plus bas commencent à partir de 0,00 $

  • garantie

    Garantie de qualité de 365 jours pour tous les produits

Notes et avis

Notes
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