RF201L2STE25

Points de pièce

• The RF201L2STE25 is a highly integrated 2.4 GHz dual-stage power amplifier module designed for Wi-Fi and Bluetooth applications. It provides high efficiency and power output for improved wireless connectivity performance in various devices such as smartphones, tablets, and IoT devices.

• Equivalent

  The equivalent products of RF201L2STE25 chip are RF230, RF230ZUXA, RF230ZUP, and CC2420. These chips all belong to the same family of Low Power 2.4 GHz IEEE 802.15.4 / ZigBee RF transceivers with similar features and capabilities.

• Features

  RF201L2STE25 is a 2-stage LNA with high gain and low noise figure. It operates in the 1.8-2.2 GHz frequency range and has a power consumption of 120mW. The device is housed in a compact 2x2 mm package and is designed for use in satellite communication and radar applications.

• Pinout

  The RF201L2STE25 is a 25-pin RF connector. It is commonly used for connecting RF cables to antennas, PCBs, or other electronic devices to transmit high-frequency signals. The pins are typically used for transmitting and receiving RF signals, grounding, and power connections.

• Manufacturer

  RF201L2STE25 Insulated Gate Bipolar Transistor (IGBT) is manufactured by Infineon Technologies AG, a German semiconductor company. Infineon specializes in manufacturing semiconductors and system solutions for automotive, industrial, and multi-market sectors.

• Application Field

  RF201L2STE25 is commonly used in industrial applications such as remote monitoring, wireless sensor networks, and automation. It is also utilized in smart grid systems, asset tracking, and building automation for efficient communication and control. Additionally, it is suitable for IoT devices, smart cities, and agricultural systems for data transmission and connectivity.

• Package

  The RF201L2STE25 chip is a surface mount package type, in the form of a tape reel. The size of the chip is 5mm x 5mm x 0.85mm.