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$5000NXP SC18IS602BIPW,112
This product facilitates communication through a 16-T SPI interface
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Marques: NXP Semiconductor
Pièce Fabricant #: SC18IS602BIPW,112
Fiche de données: SC18IS602BIPW,112 Datasheet (PDF)
Colis/Caisse: TSSOP-16
type de produit: Controllers
Statut RoHS:
État des stocks: 2 494 pièces, nouveau original
Warranty: 1 Year Ovaga Warranty - Find Out More
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SC18IS602BIPW,112 Description générale
The SC18IS602BIPW,112, developed by NXP Semiconductors, is a versatile I2C-bus/SPI interface bridge that facilitates seamless connectivity between microcontrollers and serial peripheral devices. Operating in both master and slave modes, this chip enables efficient communication with various devices such as EEPROMs, sensors, and displays. With a wide voltage range of 1.8V to 3.6V, it caters to a diverse range of applications. Equipped with a built-in clock generator, the SC18IS602BIPW,112 reduces the need for additional components, simplifying system design. Furthermore, it features a programmable I/O port, offering flexibility for customized system designs. Packaged in a compact form, this device is well-suited for space-constrained applications, delivering reliable and efficient interfacing capabilities
Caractéristiques
- A reliable and efficient communication solution
- Suitable for various applications including industrial automation
- Supports baud rates up to 5Mbit/s for fast data transmission
- Features auto flow control and software flow control modes
Application
- Efficiently integrates communication protocols
- Bridge microcontrollers to SPI peripherals
- Ideal for industrial automation applications
Caractéristiques
Paramètre | Valeur | Paramètre | Valeur |
---|---|---|---|
feature-maximum-operating-supply-voltage-v | 3.6 | feature-process-technology | |
feature-minimum-operating-supply-voltage-v | 2.4 | feature-packaging | Bulk |
feature-rad-hard | feature-pin-count | 16 | |
feature-supplier-package | TSSOP | feature-standard-package-name1 | SOP |
feature-cecc-qualified | No | feature-esd-protection | |
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | EAR99 |
feature-svhc | No |
Expédition
Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
Modalités de paiement | Frais de main | |
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Virement bancaire | facturer des frais bancaires de 30,00 $ US. |
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Pay Pal | facturer des frais de service de 4,0 %. |
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Carte de crédit | facturez des frais de service de 3,5%. |
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Western union | charge US.00 banking fee. |
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Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Étape1 :Produit
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Étape2 :Emballage sous vide
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Étape3 :Sac antistatique
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Étape4 :Emballage individuel
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Étape5 :Boîtes d'emballage
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Étape6 :étiquette d'expédition à code-barres
Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Points de pièce
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The SC18IS602BIPW is a versatile, fully-integrated bridge IC from NXP Semiconductors that allows for easy communication between SPI and I2C interfaces. It features an I2C-bus/SPI interface which enables communication with a variety of microcontrollers and peripheral devices. The chip also includes advanced features such as hardware-selectable slave addresses and a programmable.
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Equivalent
The equivalent products of SC18IS602BIPW,112 chip are SC18IS602BIPW,112 and SC18IS602BIPH,112 chips from NXP Semiconductors. They are I2C-bus/SPI interface bridge with an internal register set. -
Features
1. Dual I2C-bus/SPI interface 2. Single serial input supported by an I2C-bus or SPI 3. Configurable SPI bus clock speed up to 5Mbit/s 4. 5 V tolerant I2C-bus/SPI-bus pins 5. PNP input pins do not require pull-down resistors 6. GPIO pins present for general-purpose parallel I/O expansion -
Pinout
The SC18IS602BIPW,112 is a I2C to SPI bridge IC with 20 pins. It serves as a communication interface, translating data between I2C and SPI protocols. It enables microcontrollers with only I2C interfaces to communicate with devices that use SPI. -
Manufacturer
The manufacturer of SC18IS602BIPW,112 is NXP Semiconductors. NXP Semiconductors is a global semiconductor company focused on secure connections and infrastructure solutions for a smarter world. They provide high-performance mixed-signal and standard product solutions that enable secure connections and improve the quality of life for people around the world. -
Application Field
SC18IS602BIPW,112 is commonly used in various applications such as industrial automation, sensor interfacing, communication devices, and smart meters. It serves as a bridge between I2C/SPI devices and UART devices, allowing for seamless communication and control in a wide range of electronic systems. -
Package
The SC18IS602BIPW,112 chip is a 16-pin TSSOP package with a form factor of 4.4mm x 5mm. It has a size of 28 square millimeters and is typically used in industrial applications for interfacing I2C or SPI buses with UART devices.
Fiche de données PDF
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