Commandes de plus de
$5000TMPN3150B1AFG
IC 1 CHANNEL(S), LOCAL AREA NETWORK CONTROLLER
Marques: Toshiba America Electronic Components
Pièce Fabricant #: TMPN3150B1AFG
Fiche de données: TMPN3150B1AFG Fiche de données (PDF)
Colis/Caisse: QFP-64
type de produit: Controllers
Statut RoHS:
État des stocks: 6 554 pièces, nouveau original
Warranty: 1 Year Ovaga Warranty - Find Out More
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TMPN3150B1AFG Description générale
Engineered for automotive applications, Toshiba's TMPN3150B1AFG microprocessor is a cutting-edge embedded microcontroller. Boasting an ARM Cortex-M3 core that can run at speeds of up to 80 MHz, this microprocessor delivers exceptional performance for real-time control tasks. Its multiple peripheral interfaces, including CAN, LIN, UART, SPI, and I2C, make it a versatile choice for communication within automotive systems. The TMPN3150B1AFG also features a robust set of on-chip components like timers, PWM channels, analog-to-digital converters, and watchdog timers, streamlining system integration and control. With its automotive-grade reliability, this microprocessor is widely utilized in automotive control systems for crucial functions such as engine control, powertrain management, and chassis control
Caractéristiques
- On-chip oscillator with frequency range of 32.768kHz to 50MHz
- Crystal oscillator support for more accurate timing
- Power-on reset and brown-out detection
Application
- Wireless technology
- Internet connected
- Remote controls
Caractéristiques
Paramètre | Valeur | Paramètre | Valeur |
---|---|---|---|
Source Content uid | TMPN3150B1AFG | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | TOSHIBA CORP |
Part Package Code | QFP | Package Description | 14 X 14 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-64 |
Pin Count | 64 | Address Bus Width | 16 |
Boundary Scan | NO | Clock Frequency-Max | 10 MHz |
External Data Bus Width | 8 | JESD-30 Code | S-PQFP-G64 |
Length | 14 mm | Low Power Mode | YES |
Number of Serial I/Os | 1 | Number of Terminals | 64 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Package Body Material | PLASTIC/EPOXY | Package Code | QFP |
Package Shape | SQUARE | Package Style | FLATPACK |
Qualification Status | Not Qualified | Seated Height-Max | 3.15 mm |
Supply Voltage-Max | 5.5 V | Supply Voltage-Min | 4.5 V |
Supply Voltage-Nom | 5 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Form | GULL WING | Terminal Pitch | 0.8 mm |
Terminal Position | QUAD | Width | 14 mm |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Expédition
Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
Modalités de paiement | Frais de main | |
---|---|---|
Virement bancaire | facturer des frais bancaires de 30,00 $ US. | |
Pay Pal | facturer des frais de service de 4,0 %. | |
Carte de crédit | facturez des frais de service de 3,5%. | |
Western union | charge US.00 banking fee. | |
Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Étape1 :Produit
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Étape2 :Emballage sous vide
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Étape3 :Sac antistatique
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Étape4 :Emballage individuel
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Étape5 :Boîtes d'emballage
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Étape6 :étiquette d'expédition à code-barres
Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Points de pièce
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TMPN3150B1AFG is a chip developed by Toshiba with integrated circuits for digital signal processing and image compression. It is designed specifically for applications in industrial image processing, security systems, and network cameras. The chip offers high-speed image processing capabilities, low power consumption, and advanced compression algorithms, making it suitable for various imaging applications.
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Equivalent
There are no direct equivalent products to the TMPN3150B1AFG chip. However, similar chips in the same family include TMPN3150B1AF, TMPN3150BXAFG, and TMPN3150BXAF. It is important to note that the specific requirements and features of the application should be taken into consideration while selecting an alternative chip. -
Features
The TMPN3150B1AFG is a System-on-Chip (SoC) designed by Toshiba. It features a high-performance ARM Cortex-A9 quad-core processor, clocked at 1.3 GHz, with integrated graphics capabilities. It is designed for use in applications such as automotive infotainment systems, industrial automation, and smart appliances. -
Pinout
The TMPN3150B1AFG is a microcontroller by Toshiba. It has 100 pins and is used for various applications, such as home appliances and industrial equipment. -
Manufacturer
The manufacturer of the TMPN3150B1AFG is Toshiba Corporation. Toshiba Corporation is a Japanese multinational conglomerate company that specializes in various products and services, including information technology, consumer electronics, and energy systems. -
Application Field
The TMPN3150B1AFG is a System-on-Chip (SoC) designed for use in digital signage applications. It offers advanced multimedia processing capabilities, including support for 4K Ultra HD video playback, audio decoding, and networking. This makes it suitable for applications such as advertising displays, information kiosks, and video walls in various public environments. -
Package
The TMPN3150B1AFG chip has a BGA package type (Ball Grid Array), it has a 272-ball form, and its size is approximately 13mm x 13mm.
Nous fournissons des produits de haute qualité, un service attentionné et une garantie après-vente
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Nous avons des produits riches, pouvons répondre à vos différents besoins.
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La quantité minimum de commande commence à partir de 1 pièce.
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Les frais d'expédition internationaux les plus bas commencent à partir de 0,00 $
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Garantie de qualité de 365 jours pour tous les produits