Infineon CY7C1470V25-200BZI

Points de pièce

• The CY7C1470V25-200BZI chip is a high-speed synchronous SRAM (Static Random Access Memory) device. It has a capacity of 32 Mb and operates at a maximum frequency of 200 MHz. This chip offers fast access times and low latency, making it suitable for applications that require high-performance memory. It is commonly used in networking equipment, telecommunications systems, and other data-intensive applications.

• Equivalent

  There are no direct equivalent products for the CY7C1470V25-200BZI chip. However, it belongs to the family of high-performance synchronous dual-port RAMs and has similar features to other chips in this family, such as the CY7C1474V25-200BZI and CY7C1472V25-200BZI.

• Features

  CY7C1470V25-200BZI is a 18-megabit synchronous SRAM with a low-power architecture and a fast access time of 25ns. It operates on a 2.5V power supply and is suited for high-performance applications. It has a high-speed clock of 200MHz and is organized as 512K x 36. The device is offered in a 119-ball BGA package.

• Pinout

  The CY7C1470V25-200BZI is a 256K x 36 synchronous SRAM module with a 200MHz frequency and a voltage range of 2.375V to 2.625V. It has a 119-ball grid array package with a pin count of 119. The pin functions include address lines, data input/output lines, control signals, and power and ground connections.

• Manufacturer

  The manufacturer of the CY7C1470V25-200BZI is Cypress Semiconductor Corporation. Cypress Semiconductor is an American company that designs and manufactures integrated circuits and other electronic components. They specialize in providing solutions for automotive, industrial, consumer electronics, and communication sectors.

• Application Field

  The CY7C1470V25-200BZI is commonly used in high-performance computing, networking, telecommunications, and storage applications. It is a DDR4 Synchronous DRAM module with a capacity of 16 GB, operating at a speed of 200 MHz, and offers high bandwidth and low latency for data-intensive tasks in these sectors.

• Package

  The CY7C1470V25-200BZI chip is packaged in a 165-ball grid array (BGA) package. The form factor is a square shape with a dimension of approximately 13mm x 13mm.