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$5000Altera EP3C10E144I7
EP3C10E144I7 FPGA operating at 65nm Technology with 10320 cells and 1.2V voltage
Marques: Altera Corporation (Intel)
Pièce Fabricant #: EP3C10E144I7
Fiche de données: EP3C10E144I7 Datasheet (PDF)
Colis/Caisse: QFP144
type de produit: FPGAs (Field Programmable Gate Array)
Statut RoHS:
État des stocks: 2 309 pièces, nouveau original
Warranty: 1 Year Ovaga Warranty - Find Out More
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EP3C10E144I7 Description générale
The EP3C10E144I7 is a powerful FPGA developed by Intel, offering a wide range of features including 10,320 logic elements, 366 Kbits of embedded memory, and 288 multipliers. Its low power consumption and high-performance capabilities make it suitable for various applications such as industrial control systems, automotive electronics, and communications equipment. With a maximum operating frequency of 260 MHz and 144 I/O pins, it provides efficient connectivity to external devices. Additionally, its compact size and low power consumption make it ideal for portable and battery-operated devices
Caractéristiques
- "EP3C" refers to the Cyclone III series of FPGAs, which are programmable logic devices designed for digital logic applications.
- "10" refers to the specific family member within the Cyclone III series, with different numbers indicating different levels of capacity and performance.
- "E144" refers to the package type and pin count. "E144" indicates a 144-pin FineLine BGA (Ball Grid Array) package, which is a type of integrated circuit package with solder balls on the bottom for surface mounting onto a printed circuit board.
- "I7" refers to the speed grade or performance rating of the FPGA. "I7" indicates a commercial-grade (0 to 85 degrees Celsius) device.
Application
- Logic capacity: It has a capacity of up to 10,000 logic elements (LEs), which are the basic building blocks of programmable logic.
- Embedded memory: It may include up to 414 kilobits (Kb) of embedded memory for storing data within the FPGA.
- Digital signal processing (DSP) blocks: It may include up to 54 embedded DSP blocks for implementing high-performance digital signal processing functions.
- I/O interfaces: It may have various I/O interfaces such as GPIO (General Purpose Input/Output) pins, LVDS (Low Voltage Differential Signaling) channels, and other interfaces for communication with external devices.
- Clocking resources: It may include phase-locked loops (PLLs) and clock multiplexers for generating and distributing clock signals within the FPGA.
Caractéristiques
Paramètre | Valeur | Paramètre | Valeur |
---|---|---|---|
feature-family-name | Cyclone® III | feature-process-technology | 65nm |
feature-maximum-number-of-user-i-os | 94 | feature-number-of-registers | |
feature-device-logic-cells | 10320 | feature-device-system-gates | |
feature-number-of-multipliers | 23 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 414 | feature-total-number-of-block-ram | 46 |
feature-ethernet-macs | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz | |
feature-supported-ip-core-manufacture | Altera/Freescale/CAST, Inc/MorethanIP/PLDA | feature-maximum-number-of-serdes-channels | |
feature-device-logic-units | 10320 | feature-device-number-of-dlls-plls | 2 |
feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
feature-dedicated-dsp | feature-pci-blocks | ||
feature-programmability | No | feature-maximum-internal-frequency-mhz | 437.5 |
feature-speed-grade | 7 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
feature-external-memory-interface | DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 144 | feature-supplier-package | EQFP EP |
feature-standard-package-name1 | QFP | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | EAR99 |
feature-svhc | Yes |
Expédition
Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
Modalités de paiement | Frais de main | |
---|---|---|
Virement bancaire | facturer des frais bancaires de 30,00 $ US. | |
Pay Pal | facturer des frais de service de 4,0 %. | |
Carte de crédit | facturez des frais de service de 3,5%. | |
Western union | charge US.00 banking fee. | |
Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Étape1 :Produit
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Étape2 :Emballage sous vide
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Étape3 :Sac antistatique
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Étape4 :Emballage individuel
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Étape5 :Boîtes d'emballage
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Étape6 :étiquette d'expédition à code-barres
Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Pièces équivalentes
Pour le EP3C10E144I7 composant, vous pouvez envisager ces pièces de rechange et alternatives:
Numéro d'article
Marques
Emballer
Description
Numéro d'article : Embedded
Marques :
Emballer :
Description : systems: It can be used to implement digital logic functions in embedded systems such as industrial automation, robotics, and automotive electronics.
Numéro d'article : Communication
Marques :
Emballer :
Description : systems: It can be used for implementing digital signal processing and communication functions in wireless communication systems, networking equipment, and telecommunications.
Numéro d'article : Test
Marques :
Emballer :
Description : and measurement: It can be used in test and measurement equipment for implementing digital logic functions and signal processing algorithms for data analysis and measurement.
Numéro d'article : Prototyping
Marques :
Emballer :
Description : and validation: It can be used as a prototyping platform for validating and verifying digital logic designs before implementing them in application-specific integrated circuits (ASICs) or other custom hardware.
Points de pièce
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The EP3C10E144I7 chip is a member of altera's cyclone iii fpga family. it offers 10,570 logic elements, 308 kilobits of embedded memory, and five phase-locked loops. with integrated high-speed transceivers and low-power consumption, this chip is suitable for a range of applications like digital signal processing, communications, and industrial automation. it supports various i/o standards and provides flexible configuration options, making it a versatile solution for hardware designers.
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Features
The features of EP3C10E144I7 include a total of 10,320 logic elements, a maximum of 144 user i/o pins, up to 372 kbits of embedded memory, and support for high-speed transceivers. it also offers enhanced low-power capabilities, advanced dsp blocks, high-speed routing, and a flexible i/o structure, making it suitable for a wide range of applications. -
Pinout
The EP3C10E144I7 is a 144-pin fpga (field-programmable gate array) from the cyclone iii family by intel (formerly altera). it has 144 pins and can be used for various functions, such as digital logic control, signal processing, and data management. -
Manufacturer
The manufacturer of the EP3C10E144I7 is altera corporation, which is a semiconductor company specializing in programmable logic devices. -
Application Field
The EP3C10E144I7 is a programmable logic device, so its application areas vary. it can be used in a wide range of industries, including telecommunications, automotive, medical, aerospace, and consumer electronics. it can be used for applications such as signal processing, control systems, image processing, and data storage, among others. -
Package
The EP3C10E144I7 chip is available in a bga package type, with a form factor of 144 pins. the size of the chip is 17x17 mm.
Fiche de données PDF
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La quantité minimum de commande commence à partir de 1 pièce.
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Garantie de qualité de 365 jours pour tous les produits