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Intel EP4CE30F23C8N
Field Programmable Gate Array FPGA EP4CE30F23C8N
Marques: Intel
Pièce Fabricant #: EP4CE30F23C8N
Fiche de données: EP4CE30F23C8N Fiche de données (PDF)
Colis/Caisse: 484-BGA
Statut RoHS:
État des stocks: 5 946 pièces, nouveau original
type de produit: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Tous les prix sont en USD
| Qté | Prix unitaire | Prix ext |
|---|---|---|
| 1 | $19,195 | $19,195 |
| 30 | $18,353 | $550,590 |
En stock: 5 946 PC
EP4CE30F23C8N Description générale
The EP4CE30F23C8N is a field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). It belongs to the Cyclone IV E series and features 30,000 logic elements (LEs), which are basic building blocks for implementing digital circuits. The "F23" designation indicates its speed grade, with performance characteristics specified by Intel. The "C8" suggests it comes in a ceramic package, while the "N" signifies a RoHS-compliant package.This FPGA supports various configurable features like digital signal processing (DSP) blocks, memory blocks, and embedded processors, making it suitable for a wide range of applications including telecommunications, industrial automation, and automotive systems. With its embedded hard intellectual property (IP) cores, developers can integrate functions such as memory controllers and PCIe interfaces, reducing design complexity and time to market. Its versatility, low power consumption, and cost-effectiveness make it a popular choice for designers seeking flexibility in their electronic systems
Caractéristiques
The Cyclone IV device family offers the following features:
Low-cost, low-power FPGA fabric:
6K to 150K logic elements
Up to 6.3 Mb of embedded memory
Up to 360 1818 multipliers for DSP processing intensive applications
Protocol bridging applications for under 1.5 W total power
Cyclone IV GX devices offer up to eight high-speed transceivers that provide:
Data rates up to 3.125 Gbps
8B/10B encoder/decoder
8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface
Byte serializer/deserializer (SERDES)
Word aligner
Rate matching FIFO
TX bit slipper for Common Public Radio Interface (CPRI)
Electrical idle
Dynamic channel reconfiguration allowing you to change data rates andprotocols on-the-fly
Static equalization and pre-emphasis for superior signal integrity
150 mW per channel power consumption
Flexible clocking structure to support multiple protocols in a single transceiver block
Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1:
1, 2, and 4 lane configurations
End-point and root-port configurations
Up to 256-byte payload
One virtual channel
2 KB retry buffer
4 KB receiver (Rx) buffer
Cyclone IV GX devices offer a wide range of protocol support:
PCIe (PIPE) Gen 1 1, 2, and 4 (2.5 Gbps)
Gigabit Ethernet (1.25 Gbps)
CPRI (up to 3.072 Gbps)
XAUI (3.125 Gbps)
Triple rate serial digital interface (SDI) (up to 2.97 Gbps)
Serial RapidIO (3.125 Gbps)
Basic mode (up to 3.125 Gbps)
V-by-One (up to 3.0 Gbps)
DisplayPort (2.7 Gbps)
Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps)
OBSAI (up to 3.072 Gbps)
Up to 532 user I/Os
LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx
Support for DDR2 SDRAM interfaces up to 200 MHz
Support for QDRII SRAM and DDR SDRAM up to 167 MHz
Up to eight phase-locked loops (PLLs) per device
Offered in commercial and industrial temperature grades
Application
Altera’s new Cyclone® IV FPGA device family extends the Cyclone FPGA series leadership in providing the market’s lowest-cost, lowest-power FPGAs, now with a transceiver variant. Cyclone IV devices are targeted to high-volume, cost-sensitive applications, enabling system designers to meet increasing bandwidth requirements while lowering costs.Caractéristiques
| Paramètre | Valeur | Paramètre | Valeur |
|---|---|---|---|
| Series | Cyclone® IV E | Package | Tray |
| Product Status | Active | Programmabe | Not Verified |
| Number of LABs/CLBs | 1803 | Number of Logic Elements/Cells | 28848 |
| Total RAM Bits | 608256 | Number of I/O | 328 |
| Voltage - Supply | 1.15V ~ 1.25V | Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | Package / Case | 484-BGA |
| Supplier Device Package | 484-FBGA (23x23) |
Expédition
| Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
| Modalités de paiement | Frais de main | |
|---|---|---|
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Virement bancaire | facturer des frais bancaires de 30,00 $ US. |
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Pay Pal | facturer des frais de service de 4,0 %. |
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Carte de crédit | facturez des frais de service de 3,5%. |
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Western union | charge US.00 banking fee. |
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Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Points de pièce
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The EP4CE30F23C8N is a field-programmable gate array (FPGA) chip from the Altera Cyclone IV series. It features 30,000 logic elements, 608 Kbits of RAM, and 288 multipliers. It is designed for applications in telecommunications, automotive, industrial automation, and more, offering high-performance and low power consumption.
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Equivalent
The equivalent products of EP4CE30F23C8N chip are Altera Cyclone IV EP4CE30F23C8, XC4VSX35-10FF668I, and EP4CE30F23I7. -
Features
EP4CE30F23C8N is a FPGA chip from the Cyclone IV family. It has 33,280 logic elements, 528 embedded memory blocks, and 363 I/O pins. It also features up to 360 embedded multipliers, dedicated memory interfaces, and high-speed transceivers for efficient data transfer. It is suitable for a wide range of applications, including communication, automotive, and industrial control. -
Pinout
EP4CE30F23C8N is a 484-pin FPGA that offers high performance and low power consumption. It features 30,144 logic elements, 780 Kbits of RAM, and 266 embedded multipliers. This FPGA is designed for applications that require high-speed processing and advanced system integration capabilities. -
Manufacturer
The manufacturer of EP4CE30F23C8N is Intel Corporation. It is a multinational semiconductor company that designs and manufactures a wide range of products, including programmable logic devices like field-programmable gate arrays (FPGAs). Intel Corporation is also known for its central processing units (CPUs) and other integrated circuits used in various electronic devices. -
Application Field
EP4CE30F23C8N is a versatile FPGA that can be used in various applications such as telecommunications, networking, automotive, industrial automation, and consumer electronics. It offers high performance, low power consumption, and reconfigurability, making it suitable for a wide range of designs needing customizable processing capabilities. -
Package
The EP4CE30F23C8N chip is packaged in an 896-pin Fine Line Ball Grid Array (FBGA), with a form factor of 23x23 mm. The size of the chip is 30,220 logic elements, 600Kbits of RAM, and 266 18x18 bit hardware multipliers.
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Garantie de qualité de 365 jours pour tous les produits
