Commandes de plus de
$5000NXP MPC860TCVR66D4
Microprocessors - MPU POWER QUICC-NO LEAD
Marques: NXP Semiconductor
Pièce Fabricant #: MPC860TCVR66D4
Fiche de données: MPC860TCVR66D4 Datasheet (PDF)
Colis/Caisse: BGA-357
Statut RoHS:
État des stocks: 3 536 pièces, nouveau original
type de produit: Microprocessors
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Tous les prix sont en USD
Qté | Prix unitaire | Prix ext |
---|---|---|
1 | $590,714 | $590,714 |
220 | $228,599 | $50291,780 |
484 | $220,565 | $106753,460 |
1012 | $216,594 | $219193,128 |
En stock: 3 536 PC
MPC860TCVR66D4 Description générale
The MPC860TCVR66D4 stands out as a powerhouse within the PowerPC family, tailor-made for embedded applications that demand nothing short of top-tier performance. Boasting a clock speed of 66 MHz and built on the robust PowerPC 603e core, this processor is primed to deliver exceptional results for its designated functions. Equipped with a 32-bit architecture and an integrated floating-point unit (FPU), it excels in handling complex numerical tasks with unparalleled efficiency. Moreover, the MPC860TCVR66D4 is furnished with a diverse array of peripheral interfaces including UART, SPI, I2C, and Ethernet, ensuring seamless connectivity options for embedded systems. Its on-chip memory management unit (MMU) support further enhances performance by streamlining memory access and management for multitasking operating systems. Unquestionably, this processor is the ideal choice for a wide spectrum of embedded applications ranging from industrial control systems to networking equipment and automotive electronics, where steadfast reliability and real-time performance are imperative
Caractéristiques
- This PowerQUICC processor integrates multiple functions onto a single chip
- The MPC860TCVR66D4 is a highly integrated processor with enhanced communication capabilities
- It features advanced peripherals and memory management units for efficient data transfer
- This powerful processor has on-chip serial interfaces, DMA controllers, and memory management
- The MPC860TCVR66D4 processor combines multiple functions onto one chip for improved performance
- This highly integrated processor integrates many functions including memory management
Application
- Automotive systems
- for its
- performance
Caractéristiques
Paramètre | Valeur | Paramètre | Valeur |
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Pin Count | 357 | Package Category | BGA |
Released Date | Mar 14, 2023 |
Expédition
Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours | |
LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
Modalités de paiement | Frais de main | |
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Virement bancaire | facturer des frais bancaires de 30,00 $ US. | |
Pay Pal | facturer des frais de service de 4,0 %. | |
Carte de crédit | facturez des frais de service de 3,5%. | |
Western union | charge US.00 banking fee. | |
Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Étape1 :Produit
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Étape2 :Emballage sous vide
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Étape3 :Sac antistatique
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Étape4 :Emballage individuel
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Étape5 :Boîtes d'emballage
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Étape6 :étiquette d'expédition à code-barres
Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Points de pièce
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The MPC860TCVR66D4 chip is a PowerQUICC II Pro processor that features a dual-core architecture and is designed for networking applications. It offers a high level of integration, including a system controller, security engine, Ethernet interface, and Fast Ethernet MACs. The chip is known for its reliability, performance, and flexibility in networking environments.
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Features
The MPC860TCVR66D4 is a microprocessor with a PowerPC architecture. It features a clock speed of 66 MHz, a dual-issue, superscalar core, and a 32-bit internal data bus. It also has integrated peripherals, including a memory controller, a time base, and a communication controller, making it suitable for embedded systems applications. -
Pinout
The MPC860TCVR66D4 has 196 pins and is a microprocessing unit from the PowerPC 8xx family. It is commonly used in embedded systems and features a 66 MHz clock speed. The pins serve various functions, including data and address bus connections, control signals, clock inputs, and power and ground connections. -
Manufacturer
The manufacturer of the MPC860TCVR66D4 is NXP Semiconductors. NXP is a semiconductor and software company that provides solutions for automotive, industrial, mobile, and communication sectors. They specialize in high-performance mixed-signal electronics and are known for their expertise in developing secure connectivity solutions, microcontrollers, and integrated circuits. -
Application Field
The MPC860TCVR66D4 is a microprocessor commonly used in embedded systems and telecommunication applications. It is suited for various application areas such as network routers, switches, industrial control systems, automotive systems, and telecommunications infrastructure. Its features and capabilities make it suitable for real-time, high-performance computing in these diverse fields. -
Package
The MPC860TCVR66D4 chip is in a 256-BBGA package type, with a ball grid array (BGA) form, and its size is 17mm x 17mm.
Fiche de données PDF
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La quantité minimum de commande commence à partir de 1 pièce.
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Garantie de qualité de 365 jours pour tous les produits
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