ST STM32MP153AAC3T

STM32MP153AAC3T Description générale

The STM32MP153A/D devices are based on the high-performance dual-core Arm®Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.The STM32MP153A/D devices also embed a Cortex®-M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm®single-precision data-processing instructions and data types. The Cortex®-M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.The STM32MP153A/D devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.The STM32MP153A/D devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

Caractéristiques

• Core
  • 32-bit dual-core Arm^® Cortex^®-A7
    
    • L1 32-Kbyte I / 32-Kbyte D for each core
    
    
    • 256-Kbyte unified level 2 cache
    
    
    • Arm^® NEON™ and Arm^® TrustZone^®
  • 32-bit Arm^® Cortex^®-M4 with FPU/MPU
    
    • Up to 209 MHz (Up to 703 CoreMark^®)
• Memories
  • External DDR memory up to 1 Gbyte
    
    • up to LPDDR2/LPDDR3-1066 16/32-bit
    
    
    • up to DDR3/DDR3L-1066 16/32-bit
  • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
  • Dual mode Quad-SPI memory interface
  • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
• Security/safety
  • TrustZone^® peripherals, active tamper
  • Cortex^®-M4 resources isolation
• Reset and power management
  • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
  • POR, PDR, PVD and BOR
  • On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
  • Backup regulator (~0.9 V)
  • Internal temperature sensors
  • Low-power modes: Sleep, Stop and Standby
  • DDR memory retention in Standby mode
  • Controls for PMIC companion chip
• Low-power consumption
  • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
• Clock management
  • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
  • External oscillato

Caractéristiques