Xilinx XC7A100T-2FGG676I

Points de pièce

• The XC7A100T-2FGG676I chip is a part of the Xilinx 7 series FPGA (Field-Programmable Gate Array) family. It offers a high level of performance and flexibility and is designed for a range of applications including wired and wireless communications, industrial control, and automotive electronics. The chip has 101,440 logic cells and 600 user I/O pins, making it suitable for complex and demanding designs.

• Equivalent

  Some equivalent products of the XC7A100T-2FGG676I chip include the XC7A100T-1FGG676I, XC7A100T-3FGG676I, XC7A100T-2FGG484I, and XC7A100T-1FGG484I. These chips belong to the Xilinx Artix-7 FPGA family and have similar specifications.

• Features

  The XC7A100T-2FGG676I is a Field Programmable Gate Array (FPGA) from Xilinx. It has a capacity of 101,440 logic cells and offers a maximum of 560 DSP Slices for signal processing. The FPGA operates on a voltage range of 1.14V - 1.26V, has a 2-speed Grade 2 industrial temperature rating, and utilizes the flip-chip ball grid array (FCBGA) package.

• Pinout

  The XC7A100T-2FGG676I is a 676-pin BGA package FPGA from Xilinx. It has a pin count of 676 and offers 100,000 logic cells with 240 DSP slices. The device provides high-performance processing and I/O capabilities for various applications, including embedded systems, telecommunications, and industrial automation.

• Manufacturer

  The manufacturer of the XC7A100T-2FGG676I is Xilinx Inc. It is an American technology company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). Xilinx is known for its advanced semiconductor solutions used in a wide range of industries, including telecommunications, automotive, aerospace, and data centers.

• Application Field

  The XC7A100T-2FGG676I FPGA is commonly used in a variety of applications including industrial automation, automotive, aerospace, telecommunications, and medical devices. It provides high-performance processing capabilities, advanced connectivity options, and programmable logic to meet the demanding requirements of these industries.

• Package

  The XC7A100T-2FGG676I chip is packaged in a 676-pin, fine-grained ball grid array (FBGA) package. The form factor is compact, enabling efficient board layout. Its size is approximately 27 mm x 27 mm.