XC17S30APD8C

Points de pièce

• The XC17S30APD8C is a field-programmable gate array (FPGA) chip designed and manufactured by Xilinx. It features 30,000 system gates, 512 logic cells, and 64 I/O pads. With its advanced programmable logic technology, the chip is ideal for applications requiring high-speed data processing and complex logic functions.

• Equivalent

  Some equivalent products of the XC17S30APD8C chip include the XCR3256XL-10FTG256C, XC17S20APD8I, XC17S20APDG8C, XCR3256XL-10CSG144C, XC17V04VQ44I, and the XCR3256XL-10PQ208I. These chips are all similar in functionality and can be used as alternatives to the XC17S30APD8C in certain applications.

• Features

  The XC17S30APD8C is a field programmable gate array (FPGA) with 30,000 system gates, 512 macrocells, and 8 dedicated global low-skew clock networks. It features 3.3V or 5V operation, on-chip fast inhibit control, and highly routable and versatile building block architecture for easy design implementations.

• Pinout

  The XC17S30APD8C is a 44-pin, 5V in-system programmable configuration PROM. It is used as a configuration device for Xilinx FPGA devices. The pin count and function are as follows: Pin Count: 44 Function: In-system programmable configuration PROM for Xilinx FPGA devices.

• Manufacturer

  The XC17S30APD8C is manufactured by Xilinx, Inc., which is a semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and ACAPs. Xilinx is a global leader in the field of adaptive and intelligent computing and provides solutions for a wide range of industries including automotive, aerospace, data center, and telecommunications.

• Application Field

  The XC17S30APD8C is a field-programmable gate array (FPGA) used in a wide range of applications including telecommunications, automotive, industrial control, and consumer electronics. It is commonly used for device prototyping, system validation, and low to medium volume production due to its flexibility and reprogrammability.

• Package

  The XC17S30APD8C chip comes in a 44-pin Plastic Dual In-Line Package (PDIP), and its form is surface mount. The size of the chip is 0.300 inch wide and 1.460 inch long.