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Xilinx XC3S1600E-5FGG484C
Versatile and highly configurable FPGA IC ideal for a wide range of applications
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Marques: AMD Xilinx, Inc
Pièce Fabricant #: XC3S1600E-5FGG484C
Fiche de données: XC3S1600E-5FGG484C Datasheet (PDF)
Colis/Caisse: BGA-484
Statut RoHS:
État des stocks: 3 341 pièces, nouveau original
type de produit: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Tous les prix sont en USD
Qté | Prix unitaire | Prix ext |
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1 | $356,472 | $356,472 |
200 | $137,950 | $27590,000 |
500 | $133,102 | $66551,000 |
1000 | $130,708 | $130708,000 |
En stock: 3 341 PC
XC3S1600E-5FGG484C Description générale
This specific model boasts a high maximum operating frequency of 500 MHz and a minimum input/output delay of 1.2 ns, delivering exceptional high-speed performance. With 112 I/O pins and 576 Kb of block RAM, the XC3S1600E-5FGG484C offers versatile connectivity options and ample temporary data storage capacity. Moreover, its configurable Logic Block architecture, complemented by on-chip resources like DCMs and PLLs, enables the implementation of complex logic functions and precise timing control
![xc3s1600e-5fgg484c xc3s1600e-5fgg484c](/files/uploads/product/b/xc3s1600e-5fgg484c20201226111105_5075.jpg)
Caractéristiques
"XC3S1600E": This refers to the specific FPGA family and model. In this case, it belongs to the Xilinx Spartan-3E family, with a capacity of 1600 logic cells.
"5FGG484C": This describes the FPGA's package type and pin count. In this case, it has a Fine-Pitch Ball Grid Array (FBGA) package with 484 pins.
Application
- 1600 logic cells, which are programmable building blocks that can be configured to implement digital logic functions.
- 56 kilobits (KB) of distributed RAM and 16 multipliers for digital signal processing (DSP) applications.
- Support for various I/O standards, such as LVCMOS, LVTTL, and LVDS, making it suitable for interfacing with different types of devices.
- Built-in configuration memory for storing the FPGA configuration bitstream, which defines the desired logic functions and connections.
- JTAG programming interface for configuring the FPGA during development.
![AMD Xilinx, Inc Inventory AMD Xilinx, Inc Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Caractéristiques
Paramètre | Valeur | Paramètre | Valeur |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC3S1600E |
Number of Logic Elements: | 33192 LE | Number of I/Os: | 376 I/O |
Supply Voltage - Min: | 1.2 V | Supply Voltage - Max: | 1.2 V |
Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
Data Rate: | 333 Mb/s | Mounting Style: | SMD/SMT |
Package / Case: | FCBGA-484 | Brand: | Xilinx |
Distributed RAM: | 231 kbit | Embedded Block RAM - EBR: | 648 kbit |
Maximum Operating Frequency: | 300 MHz | Moisture Sensitive: | Yes |
Number of Gates: | 1600000 | Operating Supply Voltage: | 1.2 V |
Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
Subcategory: | Programmable Logic ICs |
Expédition
Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
Modalités de paiement | Frais de main | |
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Virement bancaire | facturer des frais bancaires de 30,00 $ US. |
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Pay Pal | facturer des frais de service de 4,0 %. |
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Carte de crédit | facturez des frais de service de 3,5%. |
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Western union | charge US.00 banking fee. |
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Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
Emballage
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Étape1 :Produit
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Étape2 :Emballage sous vide
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Étape3 :Sac antistatique
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Étape4 :Emballage individuel
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Étape5 :Boîtes d'emballage
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Étape6 :étiquette d'expédition à code-barres
Tous les produits seront emballés dans un sac antistatique. Expédié avec une protection antistatique ESD.
L'étiquette de l'emballage extérieur ESD utilisera les informations de notre société : numéro de pièce, marque et quantité.
Nous inspecterons toutes les marchandises avant expédition, garantirons que tous les produits sont en bon état et que les pièces sont neuves et correspondent à la fiche technique originale.
Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Pièces équivalentes
Pour le XC3S1600E-5FGG484C composant, vous pouvez envisager ces pièces de rechange et alternatives:
Numéro d'article
Marques
Emballer
Description
Numéro d'article : Embedded
Marques :
Emballer :
Description : systems: It can be used in various embedded systems applications, such as industrial automation, robotics, and automotive electronics.
Numéro d'article : Communication
Marques :
Emballer :
Description : systems: It can be used for implementing protocols and interfaces for communication systems, such as Ethernet, USB, and UART.
Numéro d'article : Test
Marques :
Emballer :
Description : and measurement: It can be used in test and measurement equipment for prototyping and validating digital circuits.
Points de pièce
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The XC3S1600E-5FGG484C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 1,600,000 system gates, is compatible with the 1.2V voltage standard, and operates at a speed grade of -5. The chip comes in a 484-ball, fine-pitch ball grid array (FBGA) package and offers a wide range of features and capabilities for digital circuit design and implementation.
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Equivalent
Some equivalent products of the XC3S1600E-5FGG484C chip are: XC3S1600E-4FGG484C, XC3S1600E-5FGG484, and XC3S1600E-4TTG484C. -
Features
The XC3S1600E-5FGG484C is a field-programmable gate array (FPGA) with 1,600K logic cells, support for multiple I/O standards, and a high-speed serial interface. It operates at a maximum frequency of 500MHz and has 48,128 logic slices. It also supports advanced features such as embedded block RAM and DSP slices for high-performance applications. -
Pinout
The XC3S1600E-5FGG484C is an FPGA device with 484 pins. It belongs to the Spartan-3E family and has 1,600 slices, which can be used to implement various functions and logic circuits, making it suitable for a wide range of applications. -
Manufacturer
The manufacturer of the XC3S1600E-5FGG484C is Xilinx. It is a multinational technology company that specializes in the design, development, and manufacturing of programmable logic devices (PLDs) and associated software. -
Application Field
The XC3S1600E-5FGG484C is a field-programmable gate array (FPGA) that can be used in a wide range of applications including telecommunications, data processing, automotive, defense, and industrial automation. It offers high-speed data processing, flexibility, and low power consumption, making it suitable for various complex and demanding applications. -
Package
The XC3S1600E-5FGG484C chip is a 484-pin Fine-Pitch Ball Grid Array (FBGA) package type. It has 484 solder ball contacts on the bottom surface. The chip has a size of approximately 23mm x 23mm.
Fiche de données PDF
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Garantie de qualité de 365 jours pour tous les produits