Xilinx XC3S200-4TQ144C

Points de pièce

• The XC3S200-4TQ144C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 200,000 system gates and is housed in a 144-pin Thin Quad Flat Pack (TQFP) package. The chip is designed for applications that require high-speed digital logic processing and reconfigurability. It offers flexibility and versatility in implementing complex digital systems and is widely used in various industries including telecommunications, automotive, and consumer electronics.

• Equivalent

  Some equivalent products of the XC3S200-4TQ144C chip are: 1. XC3S200-4VQG100C 2. XC3S200-4CPG132C 3. XC3S200-4FTG256C 4. XC3S200-4PQG208C Note: The "4" in the product name represents the speed grade, while the rest of the suffixes indicate different package options.

• Features

  XC3S200-4TQ144C is a field programmable gate array (FPGA) with 200,000 system gates and 192 user I/Os. It operates with a maximum frequency of 200MHz and includes 4,992 logic cells. It offers 20KB block RAM and 32 dedicated multipliers for efficient signal processing. It also supports various communication interfaces and has low power consumption.

• Pinout

  The pin count of the XC3S200-4TQ144C is 144. It is a Spartan-3 FPGA with 200,000 system gates and 4,080 slices. It offers various functions including programmable logic, internal RAM, and digital clock management.

• Manufacturer

  The manufacturer of the XC3S200-4TQ144C is Xilinx. They are an American technology company that specializes in the development and manufacturing of programmable logic devices, including field-programmable gate arrays (FPGAs).

• Application Field

  The XC3S200-4TQ144C is a Field-Programmable Gate Array (FPGA) with 200,000 system gates, which can be used in various application areas such as telecommunications, aerospace and defense, industrial control, and automotive electronics. It offers high-performance digital signal processing, logic functionality, and programmable interconnect capabilities to meet specific requirements of these industries.

• Package

  The XC3S200-4TQ144C chip has a package type of TQFP (Thin Quad Flat Package), a form of 144 pins (pins extending from the bottom surface of the chip), and a size measuring 14mm x 20mm.