Xilinx XC6SLX150T-2FGG900C

Points de pièce

• The XC6SLX150T-2FGG900C is a field-programmable gate array (FPGA) chip from Xilinx. It features 147,433 logic cells, 9,232 slices, and 450 I/O pins. With a maximum operating frequency of 667MHz, this chip is suitable for high-performance applications such as telecommunications, networking, and industrial automation.

• Equivalent

  Some equivalent products of XC6SLX150T-2FGG900C chip are XC6SLX150-2FGG900C, XC6SLX150T-2FGG676C, XC6SLX150T-2FGG484C.

• Features

  The XC6SLX150T-2FGG900C is a Xilinx Spartan-6 FPGA with 147,443 logic cells, 2700 Kbits of RAM, and 12 DSP48E slices. It features a maximum of 900 MHz clock frequency, 588 user I/Os, and supports various communication interfaces such as CAN, Ethernet, SPI, and I2C. It is ideal for high-performance and low-cost applications.

• Pinout

  XC6SLX150T-2FGG900C is a Xilinx Spartan-6 FPGA with 900 GDS. The pin count is 900 pins with a FineLine BGA package. The device features 147,433 logic cells, 4,860 Kbits of block RAM, and 206 DSP slices. It is suitable for high-performance applications requiring complex digital processing capabilities.

• Manufacturer

  The manufacturer of the XC6SLX150T-2FGG900C is Xilinx, Inc., an American technology company known for designing and developing programmable logic devices, particularly field-programmable gate arrays (FPGAs). Xilinx also offers software development tools and IP cores to support its products.

• Application Field

  The XC6SLX150T-2FGG900C is commonly used in industrial automation, automotive, aerospace, telecommunications, and scientific research applications. It is ideal for applications requiring high-performance, low power consumption, and high reliability such as signal processing, image/video processing, and networking.

• Package

  The XC6SLX150T-2FGG900C chip comes in a 900-pin flip-chip ball grid array (FBGA) package type, with a form factor of 35mm x 35mm and a size of 900 balls.