Xilinx XC6VSX475T-2FFG1156C

Points de pièce

• The XC6VSX475T-2FFG1156C chip is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx. It offers a large capacity of logic cells and memory, enabling complex designs to be implemented efficiently. With advanced features such as embedded multi-gigabit transceivers and high-speed interfaces, this chip is ideal for applications requiring high levels of performance and flexibility.

• Equivalent

  Some equivalent products of XC6VSX475T-2FFG1156C chip are XC6VSX475T-2FFG1156I, XC6VSX475T-2FFG1156E, XC6VSX475T-2FFG1156, and XC6VSX475T-2FFG1760C chips.

• Features

  XC6VSX475T-2FFG1156C is a high-performance FPGA with a capacity of 475,000 logic cells, 20.2 Mb of distributed RAM, and 1,176 I/O pins. It features 1,600 Mbps DDR3, PCIe Gen2x8, and a transceiver data rate of up to 6.6 Gbps. The device operates on a 1.0 V core voltage.

• Pinout

  The XC6VSX475T-2FFG1156C is a Virtex-6 FPGA with 1156 pins. It offers high-performance processing and advanced functionality for a wide range of applications, including communications, aerospace, and defense.

• Manufacturer

  XC6VSX475T-2FFG1156C is manufactured by Xilinx, which is an American semiconductor company specializing in programmable logic devices. Xilinx is known for its FPGA (Field-Programmable Gate Array) technology, which allows for flexible and customizable electronic systems.

• Application Field

  The XC6VSX475T-2FFG1156C FPGA is commonly used in high-performance applications such as aerospace, defense, telecommunications, and industrial automation. Its advanced processing capabilities, high-speed connectivity, and flexibility make it ideal for applications requiring fast data processing, signal processing, and complex algorithm implementation.

• Package

  The XC6VSX475T-2FFG1156C chip comes in a Flip Chip BGA package, with a 1156-pin count and a size of 31mm x 31mm.