Xilinx XC7S75-1FGGA676I

Points de pièce

• The XC7S75-1FGGA676I chip is a member of the Xilinx 7-Series FPGAs family. It is a Field Programmable Gate Array (FPGA) chip with 75,000 logic cells and several features such as programmable I/Os, built-in memory, and high-speed transceivers. The chip allows users to configure and customize its functions as per their application requirements, making it suitable for a wide range of electronic devices and systems.

• Features

  The XC7S75-1FGGA676I is an FPGA (Field-Programmable Gate Array) device manufactured by Xilinx. It has 75,000 logic cells, 3,720 Kbits of Block RAM, and 120 DSP48E1 slices. It operates at a core voltage of 1.0V and supports various I/O standards. The device comes in a 676-pin FGGA (Fine-Pitch Ball Grid Array) package.

• Pinout

  The XC7S75-1FGGA676I is a field-programmable gate array (FPGA) device from Xilinx. It has a pin count of 676 and is in a column grid array (CGA) package. The specific pin functions and descriptions can be found in the device datasheet provided by Xilinx.

• Manufacturer

  The manufacturer of the XC7S75-1FGGA676I is Xilinx. Xilinx is a semiconductor company that specializes in field-programmable gate array (FPGA) products. They are known for developing programmable logic devices used in various applications such as communication, automotive, industrial, and consumer electronics.

• Application Field

  The XC7S75-1FGGA676I is a field-programmable gate array (FPGA) that can be used in various application areas such as aerospace and defense systems, automotive electronics, industrial automation, telecommunications, and data centers. It offers high-performance processing capabilities, flexible I/O interfaces, and programmable logic that can be customized for specific applications.

• Package

  The XC7S75-1FGGA676I chip has a BGA (Ball Grid Array) package type, with 676 balls. It has a form factor of 27mm x 27mm.