Xilinx XC7Z030-3FBG484E

Points de pièce

• The XC7Z030-3FBG484E is a programmable system-on-chip (SoC) device from Xilinx, featuring a dual-core ARM Cortex-A9 processor and an FPGA fabric. It is ideal for embedded applications requiring high processing performance and hardware flexibility. This chip is available in a 484-ball BGA package.

• Equivalent

  The equivalent products of the XC7Z030-3FBG484E chip are the Xilinx Zynq-7000 family of devices, such as XC7Z015, XC7Z020, and XC7Z045. These chips are System on Chip (SoC) solutions combining a dual-core ARM Cortex-A9 processor with programmable logic fabric.

• Features

  XC7Z030-3FBG484E is a Zynq-7000 SoC with 154k logic cells, 160 DSP slices, 9 Mb block RAM, and 180 GMACs Ethernet. It supports I/O standards like LVCMOS, SSTL, and HSTL. It offers ARM dual-core Cortex-A9 processors, programmable logic, programmable analog blocks, and high-speed transceivers up to 6.25 Gb/s.

• Pinout

  The XC7Z030-3FBG484E is a 484-pin BGA package with a Zynq-7030 programmable system on chip (SoC) from Xilinx. It features a dual-core ARM Cortex-A9 processor, programmable logic, and various peripheral interfaces for communication and control.

• Manufacturer

  XC7Z030-3FBG484E is manufactured by Xilinx, which is an American company specializing in the development of programmable devices and related technologies. Xilinx is a leading provider of field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs) used in a variety of applications including data centers, automotive, aerospace, and telecommunications.

• Application Field

  The XC7Z030-3FBG484E is a highly versatile System-on-Chip (SoC) device that is commonly used in a wide range of applications including industrial automation, automotive electronics, telecommunications infrastructure, medical devices, and aerospace and defense systems. It offers high performance, low power consumption, and extensive I/O capabilities making it suitable for a variety of embedded computing applications.

• Package

  The XC7Z030-3FBG484E chip comes in a flip-chip ball grid array package, with 484 pins. It has a form factor of 17x17 mm and is designed for use in applications that require high performance processing capabilities.