Altera EP2C5F256C7N

Points de pièce

• The EP2C5F256C7N chip is a member of the Cyclone II FPGA family from Altera. It is a low-cost, low-power FPGA with 5,408 logic elements, 256 Kbits of embedded memory, and 56 embedded multipliers. It is suitable for a wide range of applications including industrial automation, automotive, and consumer electronics.

• Equivalent

  Some equivalent products of the EP2C5F256C7N chip include EP2C5T144C8N and EP2C5T144C8. These chips have similar features and capabilities, allowing them to be used interchangeably for various applications requiring a low-cost and low-power FPGA solution.

• Features

  1. Cyclone II FPGA with 5,080 logic elements. 2. 1.1 Mbits of embedded memory. 3. Configuration via JTAG or AS x1. 4. Operating frequency of up to 250 MHz. 5. Wide range of I/O options. 6. Low-cost and low-power solution for embedded systems. 7. Available in a compact 256-pin FineLine BGA package.

• Pinout

  The EP2C5F256C7N is a field-programmable gate array (FPGA) with a pin count of 256. It is commonly used for digital signal processing, telecommunications, and embedded systems. Its functions include logic processing, data storage, signal generation, and communication interface support.

• Manufacturer

  The manufacturer of the EP2C5F256C7N is Altera Corporation, which is a semiconductor company specializing in programmable logic devices such as field-programmable gate arrays (FPGAs). Altera was acquired by Intel Corporation in 2015 and is now known as Intel Programmable Solutions Group.

• Application Field

  The EP2C5F256C7N can be used in a variety of application areas, including industrial automation, automotive electronics, telecommunications, and consumer electronics. It is commonly used for digital signal processing, video processing, and high-performance computing applications due to its high-speed processing capabilities and low power consumption.

• Package

  The EP2C5F256C7N chip is a Field-Programmable Gate Array (FPGA) in a 256-pin Fine Line BGA (Ball Grid Array) package. Its form factor is integrated circuit (IC) and the size of the package is 17 mm x 17 mm.