Xilinx XC6VLX240T-1FFG1156I

Points de pièce

• The XC6VLX240T-1FFG1156I is a high-end FPGA chip manufactured by Xilinx. It offers a large number of configurable logic blocks, high-speed serial transceivers, and advanced memory resources. The chip is designed for demanding applications requiring high performance, flexibility, and scalability. It is commonly used in industries such as telecommunications, aerospace, defense, and scientific research.

• Equivalent

  Xilinx XC6VLX240T-1FFG1156I is a Virtex-6 FPGA chip with specific features. There are no direct equivalent products, as each FPGA chip is unique and cannot be matched perfectly. However, other FPGA chips within the same Virtex-6 family may have similar functionalities and capabilities, but not identical.

• Features

  The XC6VLX240T-1FFG1156I is an FPGA (Field Programmable Gate Array) with 240,000 logic cells, capable of high-speed serial connectivity and advanced system-level functionalities. It offers flexible configuration options, high-performance processing, and on-chip memory resources. Additionally, it supports various interfaces like Ethernet, PCIe, and DDR3 for easy integration into different applications.

• Pinout

  The XC6VLX240T-1FFG1156I is a Xilinx Virtex-6 FPGA with a pin count of 1156. It is designed for programmable logic functions and high-performance applications, offering a wide range of features including high-speed serial I/O, DSP slices, Block RAM, and more.

• Manufacturer

  The manufacturer of the XC6VLX240T-1FFG1156I is Xilinx Inc. It is an American technology company specializing in the development and manufacture of programmable logic devices and associated technologies. Xilinx produces a wide range of products used in various industries, including aerospace, automotive, telecommunications, and data centers.

• Application Field

  The XC6VLX240T-1FFG1156I is an FPGA (Field Programmable Gate Array) chip and can be used in various application areas such as aerospace and defense, automotive, communications, consumer electronics, industrial automation, medical imaging, and scientific research. It provides flexibility and high-performance computing capabilities for applications in these fields.

• Package

  The XC6VLX240T-1FFG1156I chip comes in a FF1156 package type. It has a 1156-pin flip-chip ball grid array (BGA) form. The size of the chip is 35mm x 35mm.