Xilinx XC6VLX75T-3FFG484C

Points de pièce

• The XC6VLX75T-3FFG484C chip is a high-performance field-programmable gate array (FPGA) manufactured by Xilinx. It features a large number of logic cells, high-speed connectivity options, and ample memory resources. The chip is commonly used in various applications like telecommunications, automotive, and aerospace industry due to its flexibility and versatility.

• Equivalent

  Some equivalent products to the XC6VLX75T-3FFG484C chip are XC6VLX75T-3FFG1156C, XC6VLX75T-2FFG1156C, XC6VLX75T-1FFG1156C, XC6VLX75T-1FFG1156, XC6VLX75T-2FFG1156, and XC6VLX75T-3FFG1156.

• Features

  The XC6VLX75T-3FFG484C is a field-programmable gate array (FPGA) with a capacity of 75,840 logic cells, 23,800 slices, and 1,424Kbits of block RAM. It features various I/O options, including integrated Ethernet MAC, multiple I/O standards, and supports a maximum clock frequency of 550MHz.

• Pinout

  The XC6VLX75T-3FFG484C is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx. It has 484 pins and its primary function is to provide programmable logic and processing capabilities for various applications in areas like telecommunications, aerospace, and industrial automation.

• Manufacturer

  The manufacturer of the XC6VLX75T-3FFG484C is Xilinx. Xilinx is a leading American technology company that specializes in the design and production of programmable logic devices, including field-programmable gate arrays (FPGAs). They provide solutions for a wide range of applications in sectors such as aerospace, automotive, telecommunications, and data centers.

• Application Field

  The XC6VLX75T-3FFG484C is an FPGA that is commonly used in a variety of applications such as telecommunications, aerospace and defense, industrial automation, and scientific research. It offers high performance, low power consumption, and a wide range of features making it suitable for a broad range of uses.

• Package

  The XC6VLX75T-3FFG484C chip is packaged in a FG484 package type. It has a 484-ball grid array (BGA) form factor and its size is determined by the dimensions of the package, which measure approximately 23mm x 23mm.