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$5000Xilinx XC6VSX315T-1FFG1156I
This FPGA operates at 1V and comes in a 1156-pin FC-BGA package
Marques: AMD Xilinx, Inc
Pièce Fabricant #: XC6VSX315T-1FFG1156I
Fiche de données: XC6VSX315T-1FFG1156I Datasheet (PDF)
Colis/Caisse: FCBGA-1156
type de produit: FPGAs (Field Programmable Gate Array)
Statut RoHS:
État des stocks: 2 334 pièces, nouveau original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC6VSX315T-1FFG1156I Description générale
Striving for excellence, the XC6VSX315T-1FFG1156I, a state-of-the-art Virtex-6 FPGA developed by Xilinx, sets a new standard for high-performance programmable logic devices across a wide range of applications. Featuring an impressive 315,000 logic cells, this model is well-suited for complex designs with extensive computational requirements. With 24 high-speed transceivers, the device enables high-speed data transfer, seamless connectivity, and efficient communication between various system components. Furthermore, with 1,080 Kb of RAM and support for data rates of up to 12.8 Gbps, the XC6VSX315T-1FFG1156I delivers abundant memory and bandwidth for even the most demanding applications. Operating at a core voltage of 1.0V and incorporating multiple power planes for optimized power management, this FPGA ensures efficient and reliable performance. Boasting 593 user I/Os, the device facilitates seamless interfacing with external devices and peripherals. Housed in a 1156-pin flip-chip fine-pitch ball grid array (FFG1156) package, the XC6VSX315T-1FFG1156I offers a compact form factor and a high pin count, providing diverse connectivity options. Additionally, the device is RoHS-compliant, underlining its commitment to environmental sustainability
Caractéristiques
- It has a large number of programmable logic cells, which can be configured to implement complex digital circuits.
- It also includes built-in memory blocks, high-speed serial transceivers, and other digital signal processing (DSP) resources.
- XC6VSX315T-1FFG1156I operates on a 1.0V core voltage, with a maximum operating frequency of 550MHz.
- It has 315,000 logic cells, 12.8Mb of Block RAM, and 360 DSP slices, making it suitable for high-end applications that require high performance and flexibility.
Application
- XC6VSX315T-1FFG1156I can be used in a wide range of applications, including high-performance computing, telecommunications, aerospace, and defense, among others.
- Its high-speed serial transceivers make it suitable for applications that require high-speed data transmission over long distances, such as data center networking and wireless communication.
- Its large logic capacity and built-in DSP resources make it ideal for implementing complex digital signal processing algorithms used in video and image processing, radar systems, and other applications.
Caractéristiques
| Paramètre | Valeur | Paramètre | Valeur |
|---|---|---|---|
| Case/Package | FCBGA | Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount | Number of Pins | 1156 |
| Max Operating Temperature | 100 °C | Max Supply Voltage | 1.05 V |
| Min Operating Temperature | -40 °C | Min Supply Voltage | 950 mV |
| Number of I/Os | 600 | Number of Logic Blocks (LABs) | 24600 |
| Number of Logic Elements/Cells | 314880 | RAM Size | 3.1 MB |
| Speed Grade | 1 |
Expédition
| Type d'expédition | Frais d'expédition | Délai de mise en œuvre | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 jours |
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LA POSTE AÉRIENNE ENREGISTRÉE | $20.00-$40.00 (0.50 KG) | 2-5 jours |
Délai de traitement : les frais d'expédition dépendent des différentes zones et pays.
Paiement
| Modalités de paiement | Frais de main | |
|---|---|---|
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Western union | charge US.00 banking fee. |
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Paiement de Petit Montant | facturer des frais bancaires de 0,00 $ US. |
Garanties
1. Les composants électroniques que vous achetez incluent une garantie de 365 jours, nous garantissons la qualité du produit.
2. Si certains des articles que vous avez reçus ne sont pas de qualité parfaite, nous organiserons de manière responsable votre remboursement ou votre remplacement. Mais les articles doivent rester dans leur état d’origine.
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Une fois que toutes les marchandises sont garanties sans problème après l'emballage, nous les emballerons en toute sécurité et les enverrons par Global Express. Il présente une excellente résistance à la perforation et à la déchirure ainsi qu’une bonne intégrité du joint.
Pièces équivalentes
Pour le XC6VSX315T-1FFG1156I composant, vous pouvez envisager ces pièces de rechange et alternatives:
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Description
Points de pièce
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XC6VSX315T-1FFG1156I is a high-performance, field-programmable gate array (FPGA) chip from Xilinx. It offers a large capacity and advanced features, making it suitable for a wide range of applications. The chip has 315,000 logic cells, 1,200 input/output pins, and various built-in functions for efficient design implementation. It offers high-speed performance, low power consumption, and flexibility, making it a popular choice in the electronics industry.
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Equivalent
Equivalent products of the XC6VSX315T-1FFG1156I chip include the XC6VLX315T-1FFG1156I and the XC6VSX315T-2FFG1156I. -
Features
The key features of the XC6VSX315T-1FFG1156I FPGA are its high-performance logic capabilities, advanced memory resources, wide range of I/O options, and flexible clocking technology. It also offers easy system integration, efficient power management, and is suitable for a variety of applications including telecommunications, aerospace, and defense. -
Pinout
The XC6VSX315T-1FFG1156I is a field-programmable gate array (FPGA) with a pin count of 1156. Its function is to enable programmable logic and digital signal processing on a single chip, making it suitable for a wide range of applications including aerospace, automotive, and telecommunications. -
Manufacturer
The manufacturer of the XC6VSX315T-1FFG1156I is Xilinx. Xilinx is a technology company that specializes in the development and manufacturing of programmable logic devices and associated software tools. They are a leading provider of field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs) that enable flexible and customizable hardware solutions for various applications in industries such as automotive, telecommunications, and aerospace. Note: The provided response is based on general knowledge and does not pertain specifically to the XC6VSX315T-1FFG1156I. -
Application Field
The XC6VSX315T-1FFG1156I is a programmable logic device that is commonly used in high-performance applications such as aerospace and defense, telecommunications, scientific research, and industrial automation. It offers advanced features and capabilities to meet the demanding requirements of these industries. -
Package
The XC6VSX315T-1FFG1156I chip has a Flip Chip Ball Grid Array (FBGA) package type, with 1156 solder balls for connection. The size of the chip is classified as 1FFG, which indicates a medium-sized package.
Fiche de données PDF
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