Xilinx XC6VSX315T-2FFG1156C

Points de pièce

• The XC6VSX315T-2FFG1156C is a high-performance field-programmable gate array (FPGA) from Xilinx. It features a large number of programmable logic cells, high-speed connectivity interfaces, and built-in memory blocks. This FPGA is designed for demanding applications in industries such as telecommunications, aerospace, and defense that require high processing speeds and flexibility.

• Equivalent

  Some equivalent products of XC6VSX315T-2FFG1156C chip are Xilinx Virtex-6 XC6VSX315T-2FFG1156C, XC6VSX315T-2FFG1156, XC6VSX315T-2FFG1156 and Virtex-6 XC6VSX315T-2FFG1156C.

• Features

  - FPGA with 315,000 logic cells - 1,200 DSP slices - 24.8 Mb of block RAM - 1,280 Mb of UltraRAM - 16.75 Gbps transceivers - PCIe Gen3 (x16) and 150 Gbps Ethernet MAC - AES encryption with 256-bit keys - Low power consumption and advanced security features.

• Pinout

  The XC6VSX315T-2FFG1156C is a Xilinx Virtex-6 FPGA with 1156 pins. It features a high-density programmable logic design with up to 315K logic cells and provides functions such as high-speed serial I/O, embedded memory, and DSP blocks for signal processing applications.

• Manufacturer

  XC6VSX315T-2FFG1156C is manufactured by Xilinx Inc., which is an American technology company specializing in the development of programmable logic devices and associated software tools. Xilinx is known for its field-programmable gate arrays (FPGAs) and System on Chip (SoC) solutions for a range of applications including data centers, automotive, aerospace, and defense industries.

• Application Field

  The XC6VSX315T-2FFG1156C is commonly used in high-performance applications such as telecommunications, data networking, military and aerospace, and medical imaging. It is also suitable for applications in automotive, industrial automation, and scientific research that require high-speed data processing and complex algorithms.

• Package

  The XC6VSX315T-2FFG1156C chip comes in a flip-chip ball grid array (FFG) package with 1156 pins. It has a form factor of 35x35 mm and a size of 1156 solder balls.