Xilinx XC7VX690T-2FFG1157C

Points de pièce

• The XC7VX690T-2FFG1157C is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It features 690,000 logic cells, advanced DSP capabilities, and high-speed connectivity options. The chip is designed for applications requiring high processing power, such as telecommunications, networking, and aerospace systems.

• Equivalent

  Some equivalent products of the XC7VX690T-2FFG1157C chip include: 1. Xilinx Virtex-7 XC7VX690T-2FFG1927C 2. Xilinx Virtex-7 XC7VX485T-2FFG1157C 3. Xilinx Virtex-7 XC7VX690T-2FFG1927I 4. Xilinx Virtex-7 XC7VX485T-2FFG1157I

• Features

  XC7VX690T-2FFG1157C is a high-performance field-programmable gate array (FPGA) from Xilinx. It features high-speed connectivity with 2160 I/Os, 1.2 million logic cells, 141 mb of internal memory, and six integrated memory controllers. It also offers advanced features such as dynamic power management and enhanced security capabilities.

• Pinout

  XC7VX690T-2FFG1157C is a FPGA from Xilinx with 1157 pins. It features a high-density design, up to 690K logic cells, and 1660 DSP slices. It offers advanced capabilities for applications requiring high performance, such as wireless communications, aerospace, and defense.

• Manufacturer

  The manufacturer of XC7VX690T-2FFG1157C is Xilinx, Inc. Xilinx is an American technology company that specializes in designing and manufacturing programmable logic devices and related software development tools. They are known for their FPGA (Field-Programmable Gate Array) products used in a variety of industries such as automotive, telecommunications, aerospace, and defense.

• Application Field

  The XC7VX690T-2FFG1157C is a high-performance FPGA commonly used in applications such as aerospace and defense, automotive, telecommunications, and data center networking. Its advanced features and capabilities make it suitable for demanding applications requiring high processing power, flexibility, and reliability.

• Package

  The XC7VX690T-2FFG1157C chip is packaged in a flip-chip ball grid array (BGA) format with a size of 1157-balls. The chip has a package form factor of FF (1157-pin FBGA) and a size of 45 x 45 mm.