Xilinx XCKU040-2FFVA1156E

Points de pièce

• The XCKU040-2FFVA1156E chip is a versatile field-programmable gate array (FPGA) that belongs to the Xilinx Kintex UltraScale family. It offers a high-performance and low-power solution for various applications, including data center, networking, and aerospace systems. With its advanced features like high-speed transceivers, configurable logic blocks, and embedded memory, the XCKU040-2FFVA1156E chip provides flexibility and scalability in hardware development.

• Equivalent

  There are no direct equivalent products to the XCKU040-2FFVA1156E chip. However, the Xilinx Virtex UltraScale+ family offers similar FPGA chips with varying features and specifications that may be suitable depending on the specific requirements of the application.

• Features

  The features of XCKU040-2FFVA1156E include a Xilinx UltraScale+ FPGA, 965,000 logic cells, 5,520 DSP slices, 16.3 Mb of distributed RAM, 40 Mb of block RAM, 96 gigabit transceivers, and 65,520 CLB flip-flops. It also offers 640 digital I/O pins, PCIe Gen3 support, and up to 4.096 Mbits of integrated synchronous RAM.

• Pinout

  The XCKU040-2FFVA1156E is a Field Programmable Gate Array (FPGA) with a pin count of 1156. The function of the FPGA can be customized according to user requirements, as it is programmable and can implement various digital logic functions.

• Manufacturer

  The XCKU040-2FFVA1156E is manufactured by Xilinx Inc., a semiconductor company that specializes in the development and production of programmable logic devices and related software tools.

• Application Field

  The XCKU040-2FFVA1156E is a Field Programmable Gate Array (FPGA) that can be used in various applications such as data center acceleration, wired communication, wireless infrastructure, industrial automation, and aerospace and defense. It offers high-performance computing, low-power capabilities, and advanced features for these application areas.

• Package

  The XCKU040-2FFVA1156E chip is available in a Flip Chip Ball Grid Array (FCBGA) package type. It has a form factor of 1156 pins and a size of 35 mm x 35 mm.