Xilinx XC2V1000-4FG456C

Points de pièce

• The XC2V1000-4FG456C chip is a Field Programmable Gate Array (FPGA) from Xilinx. It has a capacity of 1 million system gates, operates at 4ns per gate, and comes in a FineLine BGA package with 456 pins. It offers fast and flexible reconfigurability, making it suitable for a wide range of applications in embedded systems, telecommunications, and high-performance computing.

• Equivalent

  XC2V1000-4FG456C belongs to the Xilinx Virtex-II family of FPGAs and has 1,000,000 system gates. The equivalent products would include other members of the Virtex-II family with similar gate count such as XC2V6000-4FF1152C, XC2V8000-5FF1152C, and XC2V1500-4FG676C.

• Features

  The XC2V1000-4FG456C is a Field Programmable Gate Array (FPGA) with 1 million system gates, operating at a speed grade of -4. It comes in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package, providing flexible and customizable digital logic functions and internal memory blocks for various applications.

• Pinout

  The XC2V1000-4FG456C is an FPGA device with 456 pins. It is a high-density field-programmable gate array capable of implementing complex digital circuits. The specific functions of the pins depend on the device's configuration and user design.

• Manufacturer

  The manufacturer of the XC2V1000-4FG456C is Xilinx Inc. Xilinx is an American technology company specializing in the design and manufacturing of programmable logic devices, including field-programmable gate arrays (FPGAs).

• Application Field

  The XC2V1000-4FG456C is an FPGA (Field Programmable Gate Array) that can be used in various applications including automotive, telecommunications, industrial automation, aerospace, and military. Its versatility allows it to be used in different industries that require flexible and reconfigurable hardware solutions.

• Package

  The XC2V1000-4FG456C chip comes in a Fine-Pitch Ball Grid Array (FBGA) package form with a 456-ball grid array. The package size measures approximately 23mm x 23mm.