Xilinx XC3S1600E-4FGG400C

Points de pièce

• The XC3S1600E-4FGG400C chip is a field-programmable gate array (FPGA) made by Xilinx. It belongs to the Spartan-3E FPGA family and offers 1.6 million system gates, 1536 logic cells, and 40,960 bits of block RAM. It operates at a maximum speed of 400 MHz and is mounted on a 400-ball fine-pitch ball grid array (FBGA) package. The XC3S1600E-4FGG400C is commonly used in various electronic applications requiring high-speed processing and programmability.

• Equivalent

  There are no directly equivalent products to the XC3S1600E-4FGG400C chip. However, other Xilinx Spartan-3E FPGA chips with similar characteristics may be considered for similar applications, such as the XC3S1600E-4FGG320C or the XC3S200E-4FGG320C.

• Features

  The XC3S1600E-4FGG400C is a field-programmable gate array (FPGA) with 1,576 slices, 98,304 logic cells, and 905Kbits of RAM. It offers a maximum of 1.6 million system gates, 800 MHz maximum operating frequency, integrated block RAM, and high-performance serial connectivity. Additionally, it provides ample programmable interconnect resources and is suitable for various applications.

• Pinout

  The pin count of the XC3S1600E-4FGG400C is 400. It is an FPGA (Field-Programmable Gate Array) with a capacity of 1,600,000 system gates and 1,084 equivalent logic cells. It is designed to implement digital logic functions and can be reprogrammed to fit specific applications.

• Manufacturer

  XC3S1600E-4FGG400C is manufactured by Xilinx. Xilinx is a prominent American technology company specializing in the development and production of programmable logic devices (PLDs), particularly Field-Programmable Gate Arrays (FPGAs). Xilinx is recognized as a leader in the FPGA market and provides innovative solutions for various applications, including telecommunications, automotive, aerospace, and more.

• Application Field

  The XC3S1600E-4FGG400C is commonly used in a variety of application areas such as telecommunications, automotive, industrial automation, consumer electronics, and aerospace. It can be used for tasks such as digital signal processing, image and video processing, network communication, and control systems.

• Package

  The XC3S1600E-4FGG400C chip is a field-programmable gate array (FPGA) with a FBGA package type. Its form is BGA (Ball Grid Array) and it has a size of 400 balls.